category: Low Power-High Performance

category: IoT, Security & Automotive

Startup Funding: Q2 2024
By Jesse Allen - 10 Jul, 2024 - Comments: 0

AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing sp... » read more

Research Bits: July 8
By Liz Allan - 08 Jul, 2024 - Comments: 0

2D TFETS for neuromorphic computing Researchers from the University of California Santa Barbara and Intel Labs used 2D transition metal dichalcogenide (TMD)-based tunnel-field-effect transistors (TFETs) in a neuromorphic computing platform, bringing the energy requirements to within two orders of magnitude (about 100 times) the amount used by the human brain. The 2D TFETs have lower off-sta... » read more

CHIPS For America’s National Semiconductor Technology Center (NSTC) Program
By Barry Pangrle - 03 Jul, 2024 - Comments: 0

At this year’s Design Automation Conference, Jay Lewis, director of CHIPS for America National Semiconductor Technology Center (NSTC) Program, gave a presentation on the status and direction of the Center, its priorities for this year and how the NSTC can change the long-term trajectory for innovation. Fig. 1: Dr. Jay Lewis, director of NSTC Program, CHIPS R&D Office at the Dept. o... » read more

Advances in 3D-IC At DAC 2024
By Marc Swinnen - 26 Jun, 2024 - Comments: 0

At the 2024 Design Automation Conference and Exhibit, Ansys, in collaboration with NVIDIA, has been showcasing its latest advances in 3D-IC multiphysics analysis, visualization, and signoff. Ansys solutions are on display for thermal integrity, power integrity, signal integrity, and mechanical integrity for multi-die (3D-IC) electronic assemblies. The DAC Exhibitor Forum sessions, sponso... » read more

Research Bits: June 25
By Liz Allan - 25 Jun, 2024 - Comments: 0

Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

LPDDR Memory Is Key For On-Device AI Performance
By Nidish Kamath - 24 Jun, 2024 - Comments: 1

Low-Power Double Data Rate (LPDDR) emerged as a specialized high performance, low power memory for mobile phones. Since its first release in 2006, each new generation of LPDDR has delivered the bandwidth and capacity needed for major shifts in the mobile user experience. Once again, LPDDR is at the forefront of another key shift as the next wave of generative AI applications will be built into ... » read more

Powering Next-Generation Insightful Design
By Sara Louie - 24 Jun, 2024 - Comments: 0

The Ansys team is gearing up for an exciting time at DAC this week, where we’ll be sharing a whole new way of visualizing physical phenomena in 3D-IC designs, powered by NVIDIA Omniverse, a platform for developing OpenUSD and RTX-enabled 3D applications and workflows. Please attend our Exhibitor Forum session so we can show you the valuable design insights you can gain by interactively viewin... » read more

Research Bits: June 18
By Jesse Allen - 18 Jun, 2024 - Comments: 0

Gallium nitride can take the heat Researchers from Massachusetts Institute of Technology (MIT), the UAE's Technology Innovation Institute, Ohio State University, Rice University, and Bangladesh University of Engineering and Technology investigated the performance of ohmic contacts in a gallium nitride (GaN) device at extremely high temperatures, such as those that would be required for devices... » read more

IC Industry’s Growing Role In Sustainability
By Ann Mutschler - 17 Jun, 2024 - Comments: 1

The massive power needs of AI systems are putting a spotlight on sustainability in the semiconductor ecosystem. The chip industry needs to be able to produce more efficient and lower-power semiconductors. But demands for increased processing speed are rising with the widespread use of large language models and the overall increase in the amount of data that needs to be processed. Gartner estima... » read more

Why PCIe 7.0 Over Optics
By Keivan Javadi Khasraghi - 13 Jun, 2024 - Comments: 0

By Keivan Javadi Khasraghi and Ruben Sousa Data centers are currently facing the increasing need to enhance their bandwidth capacities. This surge is largely driven by the rise of new technologies, especially the growing demand for AI and machine learning applications. As these technologies advance, bandwidth requirements are projected to expand dramatically. As Large Language Models (LLMs) ... » read more

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