Optimizing Optical Fiber Connections In Hyperscale Datacenters: A Simulation-Driven Approach


Hyperscale datacenters are redefining the limits of data transmission technology, driven by increasing demands for higher bandwidth, lower power consumption, and reduced latency. Through advanced simulation workflows and multiphysics integration, engineers can design, optimize, and validate optical coupling systems for next-generation datacenters. The use of Ansys Optics software for photonic c... » read more

Enabling The 448G Era: System Architecture And Standards For Next-Gen AI Networks


As Artificial Intelligence (AI) and Machine Learning (ML) workloads continue to reshape data center infrastructure, the need for higher bandwidth and lower latency has accelerated the need for a next-generation Ethernet. This white paper examines the industry’s shift toward 448G signaling—driven by scale-up and scale-out AI cluster demands—and outlines the evolving system architecture... » read more

Why Data-Over-Sound Is An Integral Part Of Any IoT Engineer’s Toolbox


Data-over-sound technology such as Chirp presents a compelling solution for many device-to-device connectivity applications, particularly for use cases that require frictionless, low cost connectivity with nearby devices. Download this white paper to: Understand the fundamental concepts and benefits of data-over-sound connectivity Explore the key application areas within the Internet... » read more

Research Bits: Oct. 13


Mimicking neural plasticity Researchers from Korea Advanced Institute of Science and Technology (KAIST) developed a frequency switching neuristor device that mimics the intrinsic plasticity of neurons. The device can autonomously adjust the frequency of its signals, similar to the way the brain becomes less startled by repeated stimuli or becomes increasingly sensitive through training. The... » read more

Research Bits: Oct. 7


Doping oxide insulator improves SiGe conductivity Researchers from TU Wien, Johannes Kepler University Linz, and TU Bergakademie Freiberg manufactured a silicon-germanium (SiGe) transistor using an alternative approach that involves doping the insulating oxide layer to produce a long-range effect that extends into the semiconductor. Called modulation acceptor doping (MAD), the technique ena... » read more

Research Bits: Sept. 30


Hybrid memory for edge training and inference Researchers from CEA-Leti, Université Grenoble Alpes, CEA-List, the French National Centre for Scientific Research (CNRS), the University of Bordeaux, Bordeaux INP, IMS France, Université Paris-Saclay, and the Center for Nanosciences and Nanotechnologies developed a hybrid memory system that combines the traits of ferroelectric capacitors (FeCAP)... » read more

The Rise Of AI Co-Processors


Figuring out the best kinds of processors to use for different AI workloads is a challenge. AI algorithms are undergoing rapid and frequent changes, and the workloads tied to them can vary by data type, by user, and sometimes because of software/firmware updates. On top of that, AI computations tend to require much higher utilization rates than traditional computing, and that will only become m... » read more

Research Bits: Sept. 23


Opto-electrical excitation of MTJs Researchers at the University of Greifswald, International Iberian Nanotechnology Laboratory, Max Planck Institute for the Science of Light, and Aarhus University advanced the use of magnetic tunnel junctions (MTJs) for neuromorphic computing. The team developed a hybrid opto-electrical excitation scheme that combines electrical currents with short laser p... » read more

Research Bits: Sept. 16


Beyond-EUV resists Researchers from Johns Hopkins University, East China University of Science and Technology, École Polytechnique Fédérale de Lausanne (EPFL), Soochow University, Brookhaven National Laboratory, and Lawrence Berkeley National Laboratory propose a combination of new resist materials and a higher-powered EUV process that could enable smaller chip feature sizes. The "beyond... » read more

LPDDR: A Versatile Memory Powering The Next Wave Of Mobile, Edge & Endpoint Computing


The world of computing is evolving at a breakneck pace. From smartphones and ultra-thin laptops to autonomous vehicles and edge AI devices, the demand for memory that balances performance, power efficiency, and compact form factors has never been greater. This shift is driven by a few undeniable trends, including the increased deployment of AI models across verticals at the edge and higher us... » read more

← Older posts Newer posts →