category: Low Power-High Performance

category: Auto, Security & Edge AI

Research Bits: Nov. 4
By Jesse Allen - 04 Nov, 2025 - Comments: 0

Diffusive memristor for artificial neurons Researchers from the University of Southern California, University of Massachusetts, University of California Los Angeles, Syracuse University, and the Air Force Research Laboratory developed artificial neurons that replicate the complex electrochemical behavior of biological brain cells. “Our existing computing systems were never intended to pro... » read more

LPDDR6: Not Just For Mobile Anymore
By Ed Sperling - 03 Nov, 2025 - Comments: 0

LPDDR memory has been almost synonymous with mobile devices, but starting with the new LPDDR6 specification released in July 2025 by JEDEC, it will begin showing up inside of data centers, as well, early next year. The key factors in various flavors of DRAM are bandwidth, capacity, and cost. HBM is the fastest, but it's also expensive, and it requires a 2.5D or 3.5D packaging approach. GDDR is ... » read more

Research Bits: Oct. 28
By Jesse Allen - 28 Oct, 2025 - Comments: 0

Mushroom memristors Researchers from The Ohio State University found that common edible mushrooms can be grown and trained to act as organic memristors. The team cultured samples of shiitake and button mushrooms, dehydrated them once mature to ensure long-term viability, connected them to special electronic circuits, and then electrocuted them at various voltages and frequencies. “Myce... » read more

Critical Factors For Storing Data In DRAM
By Ed Sperling - 27 Oct, 2025 - Comments: 0

DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, bandwidth, and capacity were the primary considerations. But as the amount of data that needs to be processed, moved, and stored continues to rise, a whole new set of factors is emerging. Steven Woo, fellow and distinguished inventor at Rambus, talks about latency under load,... » read more

Unlocking Clarity: Keyphrase Trees Bring Structure To AI Text Analysis
By Mohamed Abdelkarim - 27 Oct, 2025 - Comments: 0

By Amr Hegazy, Mohamed Abdelkarim, and Reem El Adawi In the vast digital landscape of information, from intricate design specifications to extensive patent literature and complex verification reports, extracting meaningful insights often feels like searching for a needle in a haystack. This challenge is particularly acute in the semiconductor industry, where critical details are buried with... » read more

Research Bits: Oct. 21
By Jesse Allen - 21 Oct, 2025 - Comments: 0

Direct patterning with UV cross-linking Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, University of Chemistry and Technology Prague, and Sogang University developed a technique that enables the direct patterning of 2D semiconductor materials onto substrates without the use of toxic solvents. The process involves disp... » read more

Advanced Packaging: A Key Technology For The Next Generation Of Electronics
By Andy Heinig - 16 Oct, 2025 - Comments: 1

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the focus is increasingly shifting to the system level: How can processor cores, memory, sensors, and wireless modules be integrated as efficiently, compactly, and powerfully as possible within a sing... » read more

Integrated Modular Firmware Solutions: A Vital Component Of Custom Silicon Chiplet Architecture Designs
By Marc Meunier - 16 Oct, 2025 - Comments: 0

By Marc Meunier and Srini Narayana The shift from monolithic SoC designs to chiplet-based architecture isn’t just a packaging innovation. It’s a fundamental rethinking of how custom silicon is designed, manufactured, and deployed. This transition is driven by the growing impracticality of scaling large monolithic dies at advanced nodes. As die sizes increase, so do the costs, yield ri... » read more

Achieving Reliable 2m+ DAC Connectivity For AI Scale Networks With 224G PHY IP
By Abhinav Kothiala - 16 Oct, 2025 - Comments: 0

As artificial intelligence workloads and hyperscale data centers continue to evolve, the requirements for networking infrastructure are becoming increasingly stringent. High-speed, reliable connectivity is essential to support the massive data flow and low-latency demands of AI-scale environments. Passive direct attach copper (DACs) remains an attractive choice for hyperscalers and system vendo... » read more

Data Centers Boost Voltage For Higher Efficiency
By Bryon Moyer - 16 Oct, 2025 - Comments: 0

The power architecture used in HPC and AI data centers today is about to undergo a significant change in an effort to boost power efficiency. While voltages at the chip level will remain the same, the voltages leading to those chips will be kept higher for longer distances. This change has broad implications for DC-DC converters. The existing architecture brings AC to each rack, converts it ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy