category: Low Power-High Performance

category: IoT, Security & Automotive

Development Flows For Chiplets
By Brian Bailey - 15 May, 2025 - Comments: 2

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has to come together before that becomes reality. It takes an ecosystem, which is currently very rudimentary. Today, many companies have hit the reticle limit and are forced to move to multi-die solutions, but that does not create a plug-and-play chiplet market. These ear... » read more

UALink: Powering The Future Of AI Compute
By Sangeeta Soni - 15 May, 2025 - Comments: 0

On April 25, the UALink Consortium officially released the UALink 200G 1.0 Specification, marking an important milestone with support from key hyperscalar market players. It enables a low-latency, high-bandwidth fabric that supports hundreds of accelerators in a pod and facilitates simple load-and-store semantics. Motivation behind UALink The rapid evolution of Artificial Intelligence (AI) an... » read more

AI Accelerators Moving Out From Data Centers
By Ann Mutschler - 15 May, 2025 - Comments: 0

Experts At The Table: The explosion in AI data is driving chipmakers to look beyond a single planar SoC. Semiconductor Engineering sat down to discuss the need for more computing and the expanding role of chiplets with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vice president of marketing at Expedera; ... » read more

How To Optimize Products For Performance And Sustainability
By Mehru Singh - 15 May, 2025 - Comments: 0

By Mehru Singh and Tim Ebdon Developing sustainable products is key to a company's success. From complying with regulatory requirements and meeting corporate net-zero goals to providing a superior consumer experience and reducing costs, a company’s ability to design, develop, manufacture, and source parts and components sustainably strengthens its market position. While companies have deve... » read more

MIPI in FPGAs for Mobile-Influenced Devices
By Mixel - 14 May, 2025 - Comments: 0

A new wave of applications for mobile-influenced devices, using technology initially designed for mobile devices, demand high-resolution, high-frame-rate streaming data from vision sensors, especially with the rise of AI inference models performing real-time scene and object classification. These applications include automotive, home automation displays, medical device displays, survei... » read more

Impact of AI On IP And Chip Design
By Expedera - 14 May, 2025 - Comments: 0

By Global Semiconductor Alliance (GSA) In conjunction with the Global Semiconductor Alliance's IP Interest group, Expedera explores the impact of AI on intellectual property (IP) and Chip Design, providing comprehensive details and multifaceted data to cover all aspects of the semiconductor industry. It highlights AI growth trends, market predictions, and current silicon chip design innovati... » read more

Report: The Future of AI Processing
By Arm - 14 May, 2025 - Comments: 0

AI is now emerging in everyday use cases thanks to advances in foundational models, powerful chip technology, and abundant data. As a result, new approaches in AI compute are required to deploy these advanced use cases with minimal effort. This report features insights on how to move AI forward from industry leaders at AWS, Meta, Samsung and Arm, and includes research from MIT Technology Rev... » read more

Innovus+ Synthesis And Implementation System
By Cadence - 14 May, 2025 - Comments: 0

The Innovus+ platform incorporates Innovus synthesis and Innovus implementation capabilities, all integrated into one unified environment for outstanding ease of use and power, performance, and area (PPA) results. Innovus+ Synthesis can be used standalone to generate physically aware netlists ready for handoff to other design teams, such as ASIC partners, or the implementation flow can conti... » read more

E-Powertrain EMC Design And Validation
By Ansys - 14 May, 2025 - Comments: 0

In the pursuit of zero-emission vehicles, the design of the e-powertrain and its electronic systems encounters numerous challenges. From stringent regulatory requirements to the demand for enhanced performance and efficiency, the landscape is ripe with complexities. Here, simulation emerges as a vital tool, offering a pathway to navigate these challenges with precision and innovation. What y... » read more

Research Bits: May 13
By Jesse Allen - 13 May, 2025 - Comments: 0

Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

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