Research Bits: Feb. 6


Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Research Bits: Jan. 30


Etching tellurite glass Physicists from EPFL and Tokyo Tech propose a way to create photoconductive circuits, where the circuit is directly patterned onto a tellurite glass surface with femtosecond laser light. The exposure formed nanoscale tellurium and tellurium oxide crystals, both semiconducting materials. “Tellurium being semiconducting, based on this finding we wondered if it would ... » read more

Research Bits: Jan. 23


Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Rethinking Memory


Experts at the Table: Semiconductor Engineering sat down to talk about the path forward for memory in increasingly heterogeneous systems, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; and Frank Schirrmeister, vice... » read more

Research Bits: Jan. 16


3D stacking of 2D materials Researchers from Penn State University demonstrated monolithic 3D integration with 2D transistors made from 2D semiconductors called transition metal dichalcogenides. The 2D materials have unique electronic and optical properties, including sensitivity to light, making them ideal for use as sensors. “One challenge is the process temperature ceiling of 450 degre... » read more

Which Data Works Best For Voltage Droop Simulation


Experts at the Table: Semiconductor Engineering sat down to talk about the need for the right type of data, why this has to be done early in the design flow, and how 3D-IC will affect all of this, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, prod... » read more

Chip Industry Silos Are Crimping Advances


Change is never easy, but it is more difficult when it involves organizational restructuring. The pace of such restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advancements. This is due to the siloed nature of the semiconductor industry, both within the industry itself, and its relationship to surrounding industries. Inc... » read more

Is Transformer Fever Fading?


The hottest, buzziest thing bursts onto the scene and captures the attention of the business press and even the general public. Scads of articles and videos are published about The Hot Thing. And then, in the blink of an eye, the world’s attention shifts to the Next New Thing! Are we talking about the latest pop song that leads the Spotify streaming charts? Perhaps a new fashion trend that... » read more

How Can You Use ChatGPT For Software Testing?


All eyes have been on OpenAI and its brainchild ChatGPT in recent months. ChatGPT’s ability to understand and respond to complex instructions and deliver detailed responses to user prompts has led to an explosive rise in its popularity with the public. If you were to search online for “ChatGPT tips,” you can find content to help you use the tool to tailor resumes to job postings, create... » read more

Glitch Power Issues Grow At Advanced Nodes


An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

← Older posts Newer posts →