Power/Performance Costs In Chip Security


Hackers ranging from hobbyists to corporate spies and nation states are continually poking and prodding for weaknesses in data centers, cars, personal computers, and every other electronic device, resulting in a growing effort to build security into chips and electronic systems. The current estimate is that 60% of chips and systems have some type of security built in, and that percentage is ... » read more

Fallback Fails Spectacularly


Conventional AI/ML inference silicon designs employ a dedicated, hardwired matrix engine – typically called an “NPU” – paired with a legacy programmable processor – either a CPU, or DSP, or GPU. The common theory behind these two-core (or even three core) architectures is that most of the matrix-heavy machine learning workload runs on the dedicated accelerator for maximum efficienc... » read more

High-Level Synthesis Enables The Next Generation Of Edge AI Accelerators


AI is becoming pervasive. But the ever increasing complexity is a challenge for IoT systems. Achieving the highest levels of performance and efficiency in edge AI means going beyond software and off the shelf hardware. Bespoke hardware accelerators in FPGA or ASICs can deliver much higher performance while consuming less energy. Building these accelerators with High-Level Synthesis slashes desi... » read more

Three Ways To Speed Up Timing Closure Of High-Speed PCB Interfaces


On advanced high-speed interfaces, timing closure can be an iterative process that can be time-consuming and frustrating. PCB designers need techniques and tools to make the process more efficient, so they can contribute to an overall faster time to market for the design. This article discusses three ways that the new Cadence Allegro TimingVision environment speeds up timing closure of high-spe... » read more

Innovating Electric Mobility: Simulation Solutions For Electric Machines


Automakers desire solutions that can easily scale to new applications of next generation vehicles. Electrified propulsion technology is one main area where EV engineers are pushing the boundaries. Electric machine design and integration choices have system-level impacts that directly influence an automaker’s time to market and even overall market adoption. With Ansys multiphysics simulatio... » read more

How To Calculate The ROI Of Semiconductor IP Management


Intellectual property (IP) is a vital asset for technology companies. IP is often a critical factor in the valuation of a company and must be protected from accidental damage, leakage, and other negative consequences of poor handling. In the context of silicon companies that work on building silicon chips, the term IP involves overseeing both internal IP developed by the company itself and exte... » read more

Is The Transformer Era Over?


The idea of transformer networks has existed since the seminal publication of the Attention is All You Need paper by Google researchers in June 2017.  And while transformers quickly gained traction within the ML research community, and in particular demonstrated superlative results in vision applications (ViT paper), transformer networks were definitely not a topic of trendy conversation ar... » read more

Ambient Intelligence eBook


Get the lowdown on future ambient computing use cases and benefit from simple considerations you can build into your product roadmap today to ensure your platform is ready to capitalise on this burgeoning trend. This tech trends guide covers: Laying the foundations for ambient experiences Future use cases Challenges facing ambient computing use cases Six considerations to addre... » read more

Research Bits: May 13


On-chip microcapacitors Scientists from Lawrence Berkeley National Laboratory and University of California Berkeley developed microcapacitors with ultrahigh energy and power density that could be used for on-chip energy storage. The microcapacitors were made with thin films of hafnium oxide (HfO2) and zirconium oxide (ZrO2) engineered to achieve a negative capacitance effect, which increase... » read more

Research Bits: May 7


High-temperature memory Researchers from the University of Pennsylvania and Air Force Research Laboratory demonstrated memory technology capable of enduring temperatures as high as 600° Celsius for more than 60 hours while retaining stability and reliability. The non-volatile memory device consists of a metal–insulator–metal structure, incorporating nickel and platinum electrodes with a 4... » read more

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