The Implications Of AI Everywhere: From Data Center To Edge


Generative AI has upped the ante on the transformative force of AI, driving profound implications across all aspects of our everyday lives. Over the past year, we have seen AI capabilities placed firmly in the hands of consumers. The recent news and product announcements emerging from MWC 2024 highlighted what we can expect to see from the next wave of generative AI applications. AI will be eve... » read more

Quantum Computing: Top 5 Questions Answered


At one time, quantum computing was a theoretical conversation restricted to the halls of academia and the imaginations of science fiction visionaries. As breakthroughs in this emerging technology space accelerate, attention and investment are gaining momentum from commercial, governmental, and industrial sectors. The emerging quantum computing use cases are generating substantial buzz—and q... » read more

Backside Power Delivery Adds New Thermal Concerns


As the semiconductor industry gears up for backside power delivery at the 2nm node, implementation of the technology requires a re-thinking of established design practices. While some EDA tools are already qualified, designers must acquaint themselves with new issues, including making place-and-route more thermal-aware and how to manage heat dissipation with less shielding and thinner substr... » read more

Flash Memory Demystified: NOR Flash Vs. NAND Flash


By Dharini SubashChandran and Shyam Sharma In the world of flash memory, two primary types dominate the market: NOR flash and NAND flash. While they both serve as essential components in various electronic devices, they differ significantly in terms of structure, functionality, and use cases. In this blog post, we will explore the fundamental differences between NOR flash and NAND flash. ... » read more

The Rising Price Of Power In Chips


Power is everything when it comes to processing and storing data, and much of it isn't good. Power-related issues, particularly heat, dominate chip and system designs today, and those issues are widening and multiplying. Transistor density has reached a point where these tiny digital switches are generating more heat than can be removed through traditional means. That may sound manageable e... » read more

Photonics: The Former And Future Solution


Experts at the Table: Semiconductor Engineering sat down to talk about where photonics is in the hype cycle and its secure role in data centers, with James Pond, fellow at Ansys; Gilles Lamant, distinguished engineer at Cadence; and Mitch Heins, business development manager for photonic solutions at Synopsys. What follows are excerpts of that conversation. [L-R]: Ansys’ Pond, Cadence�... » read more

Easing Automotive Software Migration


The automotive industry is on the cusp of seismic change. Multiple trends are occurring simultaneously that are impacting the entire supply chain of the industry. Software-defined vehicles (SDVs), autonomy and electrification are motivating automotive OEMs to holistically rethink the vehicle’s software and hardware development cycles. To better manage multiple compute elements and increasi... » read more

How Multiphysics Simulation Enables 3D-IC Implementation At The Speed Of Light


Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial intelligence. The semiconductor industry is shifting toward 3D-IC design to keep up with the ever-growing demand for high-performance and power-efficient devices that has outpaced the capabilities o... » read more

MIPI Deployment In Ultra-Low-Power Streaming Sensors


Streams of data from higher-speed sensors pose throughput and latency challenges for designers. However, optimizing a design for those criteria can come at the expense of increased power consumption if not conceived and executed carefully. A device like a high-resolution, high-frame-rate home security camera in a non-wired application requiring frequent battery changes or recharging will likely... » read more

Overcoming Signal Integrity Challenges Of 112G Connections


One of the big challenges with 112G SerDes (and, to a lesser extent, all SerDes) is handling signal integrity issues. In the worst case of a long-reach application, the signal starts at the transmitter on one chip, goes from the chip to the package, across a trace on a printed-circuit board (PCB), through a connector, then a cable or backplane, another connector, another PCB trace, another pack... » read more

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