category: Low Power-High Performance

category: Auto, Security & Edge AI

Integrating Data From Design, Manufacturing, And The Field
By Adam Kovac - 13 Mar, 2025 - Comments: 0

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as dimensions become smaller, and as more features are added into devices — especially with heterogeneous assemblies of chiplets running some type of AI — the potential for thermally induced structur... » read more

New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
By Siemens EDA - 12 Mar, 2025 - Comments: 0

Historically, IC package design has been a relatively simple task which allowed the die bumps to be fanned out to a geometry suitable for connecting to a printed circuit board. The package netlist was often captured by the package designer, typically using Excel to manually assign net names to the desired die bumps and BGA balls to achieve the intended connection. Modern package and interpos... » read more

Silicon Reimagined: New Foundations For The Age of AI
By Arm - 12 Mar, 2025 - Comments: 0

The semiconductor industry is undergoing a pivotal transformation driven by the rise of artificial intelligence (AI) and the slowing of traditional Moore’s Law scaling.  In this comprehensive 42 page report, several key trends shaping the industry’s future are highlighted. The push toward more specialized architectures tailored for specific workloads, particularly in AI. The critic... » read more

Application Of External CFD Modeling In Data Center Design
By Cadence - 12 Mar, 2025 - Comments: 0

Rising IT densities and AI workloads demand smarter heat management and equipment placement. This paper "Application of External CFD Modeling in Data Center Design" explores how external computational fluid dynamics (CFD) modeling provides crucial insights by resolving airflow patterns around buildings. Why Choose External CFD Modeling? Recommended by The Green Grid, it helps predict: ... » read more

Unlocking Generative AI On The Edge Across The Semiconductor Value Chain
By Expedera - 12 Mar, 2025 - Comments: 0

In the second of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group, explores “Unlocking Generative AI on the Edge across the Semiconductor Value Chain”. Included in this white paper is an examination of how members of the value chain (including IP providers, EDA vendors, fabless chip makers, foundries, OSATs, OEMs, ... » read more

LLE-Aware Design Methodology To Avoid Timing And Power Pessimism
By Synopsys - 12 Mar, 2025 - Comments: 0

As chips move to ever-finer geometries, the active region (diffusion) shapes of neighboring cells can impact timing analysis and power calculations for the entire design. The LLE (Local Layout Effect) impact must be measured, but the impact is reflected very conservatively using conventional approaches. This paper describes a LLE-aware design methodology that mitigates the conservatism of co... » read more

Extracting Parasitic Impedance Of Semiconductor Power Modules
By Ansys - 12 Mar, 2025 - Comments: 0

As a key component in energy conversion system, power semiconductor devices are widely used in various applications, e.g., electric vehicles, renewable energy conversion, and uninterrupted power supplies. The trend for power converter design is always toward higher power density. Power modules that integrate multiple semiconductor devices can meet this demand. It also reduces the compl... » read more

Research Bits: Mar. 10
By Jesse Allen - 10 Mar, 2025 - Comments: 0

Incipient ferroelectricity Researchers from Penn State University and the University of Minnesota propose harnessing incipient ferroelectricity in multifunctional two-dimensional FETs to create neuromorphic computer memory. Materials with incipient ferroelectricity have no stable ferroelectric order at room temperature and need certain conditions to achieve an electrical charge. The FETs were ... » read more

Research Bits: Mar. 4
By Jesse Allen - 04 Mar, 2025 - Comments: 0

Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

What Scares Chip Engineers About Generative AI
By Adam Kovac - 26 Feb, 2025 - Comments: 0

Experts At The Table: LLMs and other generative AI programs are a long way away from being able to design entire chips on their own from scratch, but the emergence of the tech has still raised some genuine concerns. Semiconductor Engineering sat down with a panel of experts, which included Rod Metcalfe, product management group director at Cadence; Syrus Ziai, vice-president of engineering at E... » read more

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