category: Low Power-High Performance

category: IoT, Security & Automotive

Research Bits: Mar. 11
By Jesse Allen - 11 Mar, 2024 - Comments: 0

Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

Startup Funding: February 2024
By Jesse Allen - 06 Mar, 2024 - Comments: 0

A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Research Bits: Mar. 5
By Jesse Allen - 05 Mar, 2024 - Comments: 0

Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By combining GaAsSb nanowires and MoS2 nanoflakes, the team created a hetero-transistor with anti-ambipolar transfer characteristics, in which positive (holes) and negative (electron) charge car... » read more

Research Bits: Feb. 27
By Jesse Allen - 27 Feb, 2024 - Comments: 0

Phonon-magnon reservoir Researchers from TU Dortmund, Loughborough University, V. E. Lashkaryov Institute of Semiconductor Physics, and University of Nottingham were inspired by the human eye to propose an on-chip phonon-magnon reservoir for neuromorphic computing. In reservoir computing, input signals are mapped into a multidimensional space, which is not trained and only expedites recogni... » read more

New Issues In Power Semiconductors
By Ed Sperling - 26 Feb, 2024 - Comments: 0

The number of challenges is growing in power semiconductors, just as it is in traditional chips. Thermal dissipation and gradients, new design rules, and layout issues need to be considered, especially in the context of higher voltage and increased performance demands. Roland Jancke, design methodology head in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about issues in int... » read more

Research Bits: Feb. 19
By Jesse Allen - 19 Feb, 2024 - Comments: 0

DNA assembly of 3D nanomaterials Scientists from Brookhaven National Laboratory, Columbia University, and Stony Brook University developed a method that uses DNA to instruct molecules to organize themselves into targeted 3D patterns and produce a wide variety of designed metallic and semiconductor 3D nanostructures. “We have been using DNA to program nanoscale materials for more than a de... » read more

Photonics: Harnessing The Power of Light
By Raha Vafaei - 15 Feb, 2024 - Comments: 0

All around us, light is at work. The cameras on our phones, the parking sensors in our cars, the monitors on our desks — all are using the power of light to improve our daily lives thanks to a field of study called “photonics.” What is photonics? Photonics is a multidisciplinary domain that involves the generation, control, manipulation, and detection of light. Light, a form of elect... » read more

The Seven Pillars Of IC Package Physical Design
By Keith Felton - 15 Feb, 2024 - Comments: 1

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what can be currently achieved in traditional monolithic SoC designs. Figure 1. A heterogeneously integrated device with 47 chiplets. (Image Source: Intel) The evolving landscape of packagin... » read more

Expecting The Unexpected: Analyzing A Data Center Cooling Failure
By Mark Seymour - 15 Feb, 2024 - Comments: 0

Data center thermal management is often a reactive process. Servers issue warning messages, monitoring alarms activate, or employees express concern about general temperature levels/hotspots and then management decides what to do next. For incremental issues, once known, the necessary steps can be taken to resolve or improve these issues; however, what happens when a potential thermal issue onl... » read more

Generative AI On Mobile Is Running On The Arm CPU
By Adnan Al-Sinan - 15 Feb, 2024 - Comments: 0

By Adnan Al-Sinan and Gian Marco Iodice 2023 was the year that showcased an impressive number of use cases powered by generative AI. This disruptive form of artificial intelligence (AI) technology is at the heart OpenAI's ChatGPT and Google’s Gemini AI model, with it demonstrating the opportunity to simplify work and advance education through generating text, images, or even audio content ... » read more

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