category: Low Power-High Performance

category: IoT, Security & Automotive

Research Bits: July 24
By Jesse Allen - 24 Jul, 2023 - Comments: 0

Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Evolution Of Equalization Techniques In High-Speed SerDes For Extended Reaches
By Madhumita Sanyal - 20 Jul, 2023 - Comments: 0

The relentless demand for massive amounts of data is accelerating the pace of high-performance computing (HPC) within the high-speed Ethernet realm. This escalation, in turn, intensified the complexity associated with designing networking SoCs, including switches, NICs, retimers, and pluggable modules. Such growth is accelerating the demand for bandwidth hungry applications to transition from 4... » read more

Improving Performance And Lowering Power In Automotive
By Ann Mutschler - 20 Jul, 2023 - Comments: 0

Automotive OEMs are boosting their investments across the semiconductor ecosystem as stepping stones toward electrification and autonomy, and they are starting to encounter some of the same issues chipmakers have been wrestling with at advanced nodes — massive compute performance, thermal and power issues, reliability over extended lifetimes, and a highly diverse and geographically distribute... » read more

Getting Rid Of Heat In Chips
By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

Analog IP Reuse
By Benjamin Prautsch - 20 Jul, 2023 - Comments: 0

Analog integrated circuit IP is essential to how microelectronic circuits and systems interact with the environment. It enables things like signal conversion, stable power supply, and communication in state-of-the-art devices. However, designing these critical components – even though they are often a small part of complex chips – is very costly and risk-prone. And in today’s analog field... » read more

Generative AI Training With HBM3 Memory
By Frank Ferro - 20 Jul, 2023 - Comments: 0

One of the biggest, most talked about application drivers of hardware requirements today is the rise of Large Language Models (LLMs) and the generative AI which they make possible.  The most well-known example of generative AI right now is, of course, ChatGPT. ChatGPT’s large language model for GPT-3 utilizes 175 billion parameters. Fourth generation GPT-4 will reportedly boost the number of... » read more

A Bridge From Mars To Venus
By Steve Roddy - 20 Jul, 2023 - Comments: 0

In a now-famous 1992 pop psychology book titled "Men Are from Mars, Women Are from Venus," author John Gray posited that most relationship troubles in couples stem from fundamental differences in socialization patterns between men and women. The analogy that the two partners came from different planets was used to describe how two people could perceive issues in completely different and sometim... » read more

Mitigating Electromigration In Chip Design
By Akanksha Soni - 20 Jul, 2023 - Comments: 0

From smartphones to laptops, we use a variety of devices every day that rely on integrated circuits (ICs), or chips, to function. These chips are made up of thousands of transistors and interconnects, which transmit electrical signals from one part of the chip to another. But as demand for speed and complexity forces more energy through ever-smaller devices, this concentrated current flow can t... » read more

HBM’s Future: Necessary But Expensive
By Karen Heyman - 20 Jul, 2023 - Comments: 0

High-bandwidth memory (HBM) is becoming the memory of choice for hyperscalers, but there are still questions about its ultimate fate in the mainstream marketplace. While it’s well-established in data centers, with usage growing due to the demands of AI/ML, wider adoption is inhibited by drawbacks inherent in its basic design. On the one hand, HBM offers a compact 2.5D form factor that enables... » read more

Improved Arm Server Price-Performance For HPC
By David Lecomber - 20 Jul, 2023 - Comments: 0

The availability of Amazon EC2 Hpc7g instances with the AWS Graviton3E and Elastic Fabric Adapter (EFA) is opening new opportunities in key areas: Manufacturing Aerospace Automotive engineering Weather prediction The new AWS EC2 instance types have AWS Graviton3E’s 64 Arm Neoverse V1 cores and 8 channels of DDR5 memory. This is alongside the AWS Nitro v5 card with EFA deliver... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy