Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing

By Prasad Dhond - 18 Apr, 2024 - Comments: 0

Automotive processors are rapidly adopting advanced process nodes. NXP announced the development of 5 nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5 nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3 nm processes in 2023 [3]. In the past, the automotive industry was slow to adopt the latest semiconductor technologies due to reliability conc... » read more

Enabling New Applications With SiC IGBT And GaN HEMT For Power Module Design

By Shela Aboud - 18 Apr, 2024 - Comments: 0

The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and impactful electrification is now under way for electric vehicles (EVs). Beyond the transition to electric engines, several new features and technologies are driving the electrification of vehicles... » read more

Exploring Process Scenarios To Improve DRAM Device Performance

By Yu De Chen - 18 Apr, 2024 - Comments: 0

In the world of advanced semiconductor fabrication, creating precise device profiles (edge shapes) is an important step in achieving targeted on-chip electrical performance. For example, saddle fin profiles in a DRAM memory device must be precisely fabricated during process development in order to avoid memory performance issues. Saddle fins were introduced in DRAM devices to increase channel l... » read more

Advanced Packaging Design For Heterogeneous Integration

By CP Hung - 18 Apr, 2024 - Comments: 0

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, edge AI and autonomous electrical vehicles, traditional chips are transforming i... » read more

eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography

By Jan Willis - 18 Apr, 2024 - Comments: 0

The eBeam initiative celebrated its 15th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to mark the milestone. The eBeam Initiative welcomed its 53rd member, FUJIFILM Corporation, having grown from 20 members and advisors at its launch. FUJIFILM is the first company from the chemical supply... » read more

Vast Universe Of Transistors, Worm-Bot Innovation, Glass-Based Processor Enhancement, And Atomically Efficient Chips

By Margaret Kindling - 18 Apr, 2024 - Comments: 0

What’s a sextillion? It’s the number one followed by 21 zeros — outnumbering the stars in the Milky Way. Industry analyst Jim Handy estimates that 13 sextillion transistors have been manufactured by the chip industry since the first one sprang to life in late 1947. Today, as modern graphics and artificial intelligence chips each contain billions of transistors, and the total continues t... » read more

IC Compiler II: Finding The Best Floorplan, Fast

By Synopsys - 17 Apr, 2024 - Comments: 0

As designers strive to pack more and more functionality into todays’ SoC’s, design size (in terms of the number of transistors packed into a chip) is growing almost exponentially. This growth brings with it an unbounded increase in not just the technical complexity of performing the physical layout of the design due to capacity challenges, but also requires designers to make choices that ca... » read more

A Vision For Electronics Supply Chain Management

By SEMI - 17 Apr, 2024 - Comments: 0

Supply chain disruptions and chip shortage have become household terms in recent times. COVID-19 highlighted the vulnerability of supply chains of countless industries and their critical role in the global economy. Companies across the electronics manufacturing value chain have been affected. At last count, the semiconductor shortage has already cost the automotive industry alone over $150 bill... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

By eBeam Initiative - 17 Apr, 2024 - Comments: 0

How Advantest Corporation, ASML, Fraunhofer, imec, Siemens EDA and others are using deep learning in semiconductor manufacturing. Click here to read more. » read more

Review Of Virtual Wafer Process Modeling And Metrology For Advanced Technology Development

By Coventor - 17 Apr, 2024 - Comments: 0

Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the process flow and ultimately quantifying its physical and electrical properties are critical steps in yielding mature technology. The standard build, test, and wait model of technology development ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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