category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Powering Efficiency: AI Transforms IC Manufacturing As ICs Fuel AI
By Laura Peters - 23 Oct, 2025 - Comments: 0

The push to grow today’s $500 billion-plus semiconductor industry to $1 trillion in annual revenue is challenging every aspect of the broader supply chain to embrace AI. Artificial intelligence is transforming the way fabs are architected and run, how devices are manufactured, and how server farms are constructed going forward. At the same time, all of this is being enabled by advancements... » read more

The Opportunities And Challenges Of FOPLP Technology
By Teck Lee - 23 Oct, 2025 - Comments: 0

Artificial intelligence (AI) has emerged as a major catalyst for innovation and advancement. The growing demand for AI computing power is driving heterogeneous integration toward larger packaging sizes, sparking increased interest in Fan-out Panel Level Package (FOPLP) technology. This article explores ASE’s practices and developments in this area, delving into the technical intricacies and e... » read more

Stop The Drip-Drip-Drip Of Intermittent In-Line Wafer Defects And Increase Your Yields
By Errol Akomer - 23 Oct, 2025 - Comments: 0

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years. Some process engineers call them "slow moving excursions.” And over time, those low-volume defects can add up to significant yield losses. Ignoring a problem Some intermittent process excurs... » read more

New Standardized Semiconductor Cybersecurity Assessment (SSCA) Strengthens Security And Collaboration Across Global Supply Chain
By Alan Weber - 23 Oct, 2025 - Comments: 0

The SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC) Work Group 3 (Supply Chain Cybersecurity) just released a major work product that will have a significant and lasting positive impact on the industry: the “Standardized Semiconductor Cyber Assessment (SSCA)” questionnaire. Creating a common security assessment process for device makers, equipment suppliers, software s... » read more

Why In-Memory Computation Is So Important For Edge AI
By Katherine Derbyshire - 23 Oct, 2025 - Comments: 1

In popular media, “AI” usually means large language models running in expensive, power-hungry data centers. For many applications, though, smaller models running on local hardware are a much better fit. Autonomous vehicles need to respond in real-time, without data transmission delays. Medical and industrial applications often depend on sensitive data that cannot be shared with third par... » read more

Using AI/ML To Find And Correlate IC Test Data
By Ed Sperling - 15 Oct, 2025 - Comments: 0

What causes low yield in wafers? Usually it's due to design or process changes, but sometimes yield issues occur even if there haven't been any changes from one manufacturing lot to the next. Finding the cause requires some sleuthing, and the best approach for pinpointing problems is to mine design, process, and manufacturing data, and to correlate that data by date and time, by which equipment... » read more

Smarter Packaging: How AI is Reshaping Assembly and Materials Control
By Gregory Haley - 02 Oct, 2025 - Comments: 0

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries downstream costs that ripple across assembly, final test, and even system qualification. As packaging margins tighten, the industry is betting on artificial intelligence (AI) to catch those pro... » read more

Voltage Regulation Moves Into The Package
By Bryon Moyer - 29 Sep, 2025 - Comments: 0

Integrated circuits require a variety of voltages and a wide range of currents, typically supplied by voltage regulators. But increasing power density is resulting in higher power delivery losses. Moving those regulators closer to the chips they power can reduce those losses. Co-packaging them holds the most promise, but it comes with challenges. “What people have been talking about, ev... » read more

Mitigating Warpage In Multi-Chiplet Systems
By Laura Peters - 22 Sep, 2025 - Comments: 0

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple factors contribute to warpage, including larger chip sizes, severe thinning of the silicon substrate, temporary bonding and debonding processes, and scaling of bump pitch and size. Each of these ca... » read more

Virtual Metrology In Semiconductor Manufacturing
By Ed Sperling - 19 Sep, 2025 - Comments: 0

Fourth in a seven-part series: Virtual metrology may never be 100% perfect because of the almost unlimited number of changes in a fab tools and the unique chip and wafer designs they're being used to process. But there are places where virtual metrology does make sense. Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about why virtual metrology will never ... » read more

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