130 BCDLite And BCD


BCDLite and BCD process technologies offer a modular platform architecture based on the Globalfoundries’s low-power logic process with integrated low- and high-voltage bipolar transistors, high-voltage EDMOS/LDMOS transistors, precision analog passives and non-volatile memory. • New Gen2 release with significant performance improvements • BCDLite is tailored for cost-effective mobil... » read more

E-Beam Review And CD Measurement Revolutionizes Display Yield Management


Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications. To meet these demands, the display technology roadmap in this article calls for innovations in materials, processes and device technology. Critical requirements include smaller design rules and the adoption of a range of materi... » read more

Everything You Need to Know about FDSOI Technology


Over the past decades, transistor feature size has continuously decreased, leading to an increase in performance and a reduction in power consumption. Consumers have reaped the benefits, with superior electronic devices that have become increasingly useful, valuable, faster and more efficient. In recent years, as transistor feature size has shrunk below 10nm, it has become progressively more di... » read more

Manufacturing Bits: March 19


Exascale computers Intel and the U.S. Department of Energy (DOE) have set plans to develop and deliver the first exascale supercomputer in the United States. The system, called Aurora, will provide an exaFLOP of performance or a quintillion floating point computations per second. Targeted for delivery in 2021, the system is being developed at DOE’s Argonne National Laboratory. The system ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

Manufacturing Bits: March 11


Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

Week In Review: Manufacturing, Test


Chipmakers How bad is the slowdown in the IC industry? The memory market is terrible, while other markets are slowing. One company—Renesas--is feeling the brunt. Citing the IC slowdown, Renesas will temporarily halt production at 13 of the company's 14 production facilities, according to a report from Nikkei. Renesas confirmed the move. “Renesas is considering implementing measures to ... » read more

Manufacturing Bits: March 5


WAAM process Thales Alenia Space, Cranfield University and Glenalmond Technologies have produced a prototype of a titanium pressure vessel for use in future space missions. The vessel is 1 meter in height and weighs 8.5kg. The titanium alloy is made using Cranfield’s additive technology, dubbed the Wire + Arc Additive Manufacturing (WAAM) process. Related to 3D printing technology, WA... » read more

Week In Review: Manufacturing, Test


Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

The Good And Bad Of 2D Materials


Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

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