category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Engineering Talent Shortage Now Top Risk Factor
By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Feb, 2019 - Comments: 0

Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

Innovative Solutions To Increase 3D NAND Flash Memory Density
By Coventor - 21 Feb, 2019 - Comments: 0

In the last 10 years, 3D NAND flash memory has enabled a new generation of non-volatile solid-state storage useful in nearly every electronic device imaginable. 3D NAND can achieve data densities exceeding those of 2D NAND structures, due to the relative ease of 3D integration, even when fabricated on later generation technology nodes. 3D NAND structures contain vertical channels which orthogo... » read more

The Mighty Sensor In The Fab
By Ed Sperling - 21 Feb, 2019 - Comments: 1

The days of scheduled maintenance on fab equipment are coming to an end. In fact, the entire service model as we know it is about to undergo a mammoth change. The addition of more sensors into manufacturing equipment may seem like an evolutionary step, but the impact is going to be much more significant than it might appear. Rather than just alerting fab managers or equipment makers when a p... » read more

FD-SOI: How Body Bias Creates Unique Differentiation
By GlobalFoundries - 21 Feb, 2019 - Comments: 0

Fully depleted silicon-on-insulator (FD-SOI) relies on a very unique substrate whose layer thicknesses are controlled at the atomic scale. FD-SOI offers remarkable transistor performance in terms of power, performance, area and cost tradeoffs (PPAC), making it possible to cover from low-power to high-performance digital applications with a single technology platform. FD-SOI delivers numerous un... » read more

5 Top Storylines For NAND Biz
By Mark LaPedus - 21 Feb, 2019 - Comments: 0

2019 is expected to be a busy, if not difficult, year in the NAND flash memory market. Vendors will continue to ramp up 3D NAND, the successor to traditional 2D or planar NAND. Then, over the last year, prices for NAND have dropped with oversupply in the market. What’s in store in 2019? Vendors are expected to rush out their next-generation products. Then, there is a debate whether the... » read more

In-Memory Vs. Near-Memory Computing
By Mark LaPedus - 21 Feb, 2019 - Comments: 1

New memory-centric chip technologies are emerging that promise to solve the bandwidth bottleneck issues in today’s systems. The idea behind these technologies is to bring the memory closer to the processing tasks to speed up the system. This concept isn’t new and the previous versions of the technology fell short. Moreover, it’s unclear if the new approaches will live up to their billi... » read more

Creating Higher Density 3D NAND Structures
By Timothy Yang - 21 Feb, 2019 - Comments: 0

3D NAND flash memory has enabled a new generation of non-volatile solid-state storage useful in nearly every electronic device imaginable. 3D NAND can achieve data densities exceeding those of 2D NAND structures, even when fabricated on later generation technology nodes. The methods used to increase storage capacity come with potentially significant tradeoffs in memory storage, structural sta... » read more

Multiple Approaches To Memory Challenges
By Ryan Gibson - 21 Feb, 2019 - Comments: 0

As we enter the era of Big Data and Artificial Intelligence (AI), it is amazing to think about the possibilities for a truly seismic shift in the changing requirements for memory solutions. The massive amount of data humans generate every year is astounding and yet is expected to increase five-fold in the next few years from machine-generated data. Further compounding this growth is the emergin... » read more

150MM Alive and Kicking
By Applied Materials - 21 Feb, 2019 - Comments: 0

Did you think chip making on 150mm wafers was a thing of the past? Think again. Many of the megatrends shaping our collective futures—mobility, autonomous driving and electric vehicles, 5G wireless communications, augmented- and virtual reality (AR/VR), and healthcare—depend on innovations created on the 150mm wafer size. While attention is often riveted on the race to the leading-edge n... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy