category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Using Machine Learning In Fabs
By Mark LaPedus - 19 Sep, 2019 - Comments: 1

Amid the shift towards more complex chips at advanced nodes, many chipmakers are exploring or turning to advanced forms of machine learning to help solve some big challenges in IC production. A subset of artificial intelligence (AI), machine learning, uses advanced algorithms in systems to recognize patterns in data as well as to learn and make predictions about the information. In the fab, ... » read more

VC Perspectives On An AI Summer
By Michael Stewart - 19 Sep, 2019 - Comments: 0

It’s been a busy summer for Applied Ventures. Our team has had many interactions in the startup and investing space, and added some new companies to our portfolio. I’ll be sharing highlights of these activities in a series of upcoming blogs, but first I’d like to reflect on current market developments in machine learning and how they are affecting VC investment patterns. Strategic inve... » read more

The Future Of Power Needs To Be Exotic
By Applied Materials - 18 Sep, 2019 - Comments: 0

Moore’s Law follows the continual advancement of smaller silicon transistors, which is ideal for faster operating speeds in processors and increasing memory size density. However, not all solutions require smaller transistors, and not all are made on silicon wafers. LEDs are made from gallium arsenide (GaAs) and lasers use indium phosphide (InP), while power devices are transitioning to si... » read more

EUV Annual Perceptions Survey – 2019
By eBeam Initiative - 18 Sep, 2019 - Comments: 0

8th Annual Perceptions Survey – 2019 (July) of 68 luminaries across 42 different companies about use of EUV. Confidence in EUV remains high • 73% predict HVM by end of 2020 • Outlook is positive for actinic inspection and pellicle Click here to see survey slides. » read more

Effects Of A Random Process Variation On The Transfer Characteristics Of A Fundamental Photonic Integrated Circuit Component
By Coventor - 18 Sep, 2019 - Comments: 0

Silicon photonics is rapidly emerging as a promising technology to enable higher bandwidth, lower energy, and lower latency communication and information processing, and other applications. In silicon photonics, existing CMOS manufacturing infrastructure and techniques are leveraged. However, a key challenge for silicon photonics is the lack of mature models that take into account known CMOS pr... » read more

Wolfspeed GaN: Rugged Enough For Tracking Space Junk, Rugged Enough For 5G
By Wolfspeed, a Cree Company - 18 Sep, 2019 - Comments: 0

GaN RF devices are used throughout the world on projects in a broad range of applications such as surveillance and weather radar, first responder communications, and improvised explosive device (IED) protection systems, where downtime is not an option. But are they rugged and reliable enough to tackle the harshest environments the telecom market can hand out, especially as it relates to 5G smal... » read more

External Resistance Reduction By Nanosecond Laser Anneal In Si/SiGe CMOS Technology
By Veeco - 18 Sep, 2019 - Comments: 0

Authors: 1Oleg Gluschenkov, 1Heng Wu, 1Kevin Brew, 2Chengyu Niu, 1Lan Yu, 1Yasir Sulehria, 1Samuel Choi, 22Curtis Durfee, 1James Demarest, 1Adra Carr, 3Shaoyin Chen, 3Jim Willis, 3Thirumal Thanigaivelan, 1Fee-li Lie, 2Walter Kleemeier, and 1Dechao Guo 1IBM Research, 257 Fuller Road, Albany, NY 12203, USA, email: [email protected] 2GLOBALFOUNDRIES Inc., Albany, NY, USA, 3ULTRATECH, a division ... » read more

China IC Ecosystem Report, 2019 Edition
By SEMI - 18 Sep, 2019 - Comments: 0

This report covers the latest semiconductor supply chain development throughout China including the rise and the progress of China IC industry, the national and local government policies, public and private funding, and their impact of key segments of China's IC supply chain, recent market developments, and dynamics of key domestic companies and their international peers are also discussed in t... » read more

Manufacturing Bits: Sept. 17
By Mark LaPedus - 17 Sep, 2019 - Comments: 0

Full-chip inverse lithography D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). For years, ILT has been a promising technology. ILT is a next-generation reticle enhancement technique (RET) that enables an optimal photomask pattern for both optical and extreme ultraviolet (EUV) lithography reticles.... » read more

Mixed Picture Seen For EUV Masks
By Mark LaPedus - 16 Sep, 2019 - Comments: 0

The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. The EUV mask infrastructure involves several technologies that are in various stages of development. On one front, the outlook for several mask tool technol... » read more

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