category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Feb, 2019 - Comments: 0

Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

Manufacturing Bits: Jan. 29
By Mark LaPedus - 29 Jan, 2019 - Comments: 1

Thermal lithography Using a technique called thermal scanning probe lithography, New York University (NYU) and others have reported a breakthrough in fabricating 2D semiconductors. With the technology, researchers have devised metal electrodes with vanishing Schottky barriers on 2D semiconductors based on molybdenum disulfide (MoS₂). Thermal scanning probe lithography, sometimes called t-... » read more

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

Variation’s Long Tentacles
By Ed Sperling - 24 Jan, 2019 - Comments: 1

Today, most design engineers don't pay much attention to variation. It's generally considered to be a manufacturing problem. Even within the fab, various job functions are segmented enough that variation in one part of the process, such as the photomask shop, doesn't necessarily come to the attention of the people doing deposition and etch or those polishing the wafers. But increasingly, ... » read more

Variation Issues Grow Wider And Deeper
By Ed Sperling - 24 Jan, 2019 - Comments: 0

Variation is becoming more problematic as chips become increasingly heterogeneous and as they are used in new applications and different locations, sparking concerns about how to solve these issues and what the full impact will be. In the past, variation in semiconductors was considered a foundry issue, typically at the most advanced process node, and largely ignored by most companies. New p... » read more

Fearless chip and fab tool forecasts
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

2019 is expected to be a challenging, if not confusing, year for the semiconductor and fab equipment industries. For example, Apple recently issued a warning about lackluster smartphone demand, which impacted several IC vendors and foundries. Then, the memory market is plummeting. In addition, the 10nm/7nm transition has proven to be difficult for many. And let’s not forget the geopolitica... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Analyzing Worst-Case Silicon Photonic Device Performance Through Process Modeling And Optical Simulation
By Ryan Miller - 24 Jan, 2019 - Comments: 0

Silicon photonics is an emerging and rapidly-expanding design platform that promises to enable higher-bandwidth communication and other applications. One of the best qualities of silicon photonics is its ability to leverage existing CMOS fabrication equipment and process flows. However, this means that it is subject to the same process defects and variations. Previous blog posts [References 1,2... » read more

Much Ado About Memory
By Lam Research - 24 Jan, 2019 - Comments: 0

New semiconductor applications are ever changing and improving our lives, from new smartphones and wearables to healthcare, factory automation, and artificial intelligence. The humble memory chip working in the background plays a critical role in enabling these technologies. For example, that awesome picture you just took would be lost forever without memory. Your computer can’t perform the i... » read more

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