category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Tech Talk: Connected Intelligence
By Ed Sperling - 21 Jun, 2018 - Comments: 0

Gary Patton, CTO at GlobalFoundries, talks about computing at the edge, the slowdown in scaling, and why new materials and packaging approaches will be essential in the future. https://youtu.be/Zbz0R_yFFrQ » read more

Can AI Alter The Burgeoning Design Cost Trend?
By Rich Wawrzyniak - 21 Jun, 2018 - Comments: 0

Everyone in the semiconductor design arena has experienced or at least observed the impact of increasing costs for complex SoC silicon. Semico’s recently released report entitled "Silicon and Software Design Cost Analysis" reveals the cost associated with a first time design effort for a high-end, advanced performance multicore SoC using 7nm process technology can top $195M for both the silic... » read more

Big Trouble At 3nm
By Mark LaPedus - 21 Jun, 2018 - Comments: 0

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at 3nm, but the transition to this node is expected to be a long and bumpy one, filled with a slew of technical and cost challenges. For example, the design cost for a 3nm chip could exceed an eye-p... » read more

CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications
By GlobalFoundries - 20 Jun, 2018 - Comments: 0

Perpendicular Spin-Transfer Torque (STT) MRAM is a promising technology in terms of read/write speed, low power consumption and non-volatility, but there has not been a demonstration of high density manufacturability at small geometries. In this paper we present an unprecedented demonstration of a robust STT-MRAM technology designed in a 2x nm CMOS- embedded 40 Mb array. Key features are full a... » read more

High-Volume Manufacturing Device Overlay Process Control
By KLA - 20 Jun, 2018 - Comments: 0

By Honggoo Leea, Sangjun Hana, Jaeson Wooa, DongYoung Leea, ChangRock Songa, Hoyoung Heob, Irina Brinsterb, DongSub Choic, John C. Robinsonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Corp., 8834 N. Capital of Texas Hwy, Austin, TX 78759 cKLA-Tencor Korea, Starplaza bldg.., 53 Metapolis-ro, Hwasung City, Gyeonggi-do, Korea Abstract ... » read more

Manufacturing Bits: June 19
By Mark LaPedus - 19 Jun, 2018 - Comments: 0

Cellulose nanopaper The Qingdao Institute of Bioenergy and Bioprocess Technology (QIBEBT) of the Chinese Academy of Sciences in China has developed a new type of cellulose nanopaper (CNP). CNP is a renewable material with good mechanical and optical properties. Potentially, CNP could be used in several applications, such as electronic devices, visual display substrates, batteries and barrie... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jun, 2018 - Comments: 0

Chipmakers and OEMs Tesla Motors has been struggling to get its new electric car, the Model 3, out the door. And it recently implemented a layoff amid ongoing losses. But the struggling car maker could be in the midst of a rebound. “Based on our checks, we believe the perceived quality of Model 3s coming off the lines continue to improve relative to prior checks, and we view this as one of t... » read more

Advanced Packaging Confusion
By Ed Sperling - 13 Jun, 2018 - Comments: 2

Advanced packaging is exploding in all directions. There are more chipmakers utilizing different packaging options, more options for the packages themselves, and a confusing array of descriptions and names being used for all of these. Several years ago, there were basically two options on the table, 3D-ICs and 2.5D. But as chipmakers began understanding the difficulty, cost and reduced benef... » read more

Delivering On The Promise Of Self-Driving Cars
By Stephen Breit - 13 Jun, 2018 - Comments: 1

Self-driving cars have been all the rage in both the trade and popular press in recent years. I prefer the term “autonomous vehicles,” which more broadly captures the possibilities, encompassing not only small passenger vehicles but mass transit and industrial vehicles as well. Depending on who’s talking, we will all be riding in fully autonomous vehicles in five to 25 years. The five-... » read more

Manufacturing Bits: June 12
By Mark LaPedus - 12 Jun, 2018 - Comments: 0

Elastic diamonds A group has developed a way to make elastic diamonds, enabling tiny diamond needles that can flex and stretch. Ulsan National Institute of Science and Technology (UNIST), the Massachusetts Institute of Technology (MIT), the City University of Hong Kong and Nanyang Technological University have developed a process that enables elastic diamonds. Elastic diamonds could one day... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy