category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Effects of a Random Process Variation on the Transfer Characteristics of a Fundamental Photonic Integrated Circuit Component
By Coventor - 24 Jan, 2019 - Comments: 0

Silicon photonics is rapidly emerging as a promising technology to enable higher bandwidth, lower energy, and lower latency communication and information processing, and other applications. In silicon photonics, existing CMOS manufacturing infrastructure and techniques are leveraged. However, a key challenge for silicon photonics is the lack of mature models that take into account known CMOS pr... » read more

Data Transfer Without Energy Loss
By Serena Brischetto - 24 Jan, 2019 - Comments: 0

SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in Dresden, Germany. To register for the event, please click here. SEMI: What is Zero energy co... » read more

Manufacturing Bits: Jan. 22
By Mark LaPedus - 22 Jan, 2019 - Comments: 1

Open-source CVD Boise State University has developed an inexpensive chemical vapor deposition (CVD) system to enable the growth of two-dimensional (2D) materials. Using open-source designs and off-the-shelf components, researchers have developed an automated CVD system for $30,000 in hardware costs, according to Boise State in the journal PLoS One. 2D materials could enable a new class ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jan, 2019 - Comments: 1

Fab tools and materials Applied Materials is expected to remain the world’s largest semiconductor equipment supplier in terms of projected sales for 2018, according to a preliminary forecast of the rankings from VLSI Research. Applied will have $14 billion in sales in 2018, according to the firm. Applied is the leader in terms of overall projected sales in 2018, followed in order by ASM... » read more

Machine Learning For IC Production
By Mark LaPedus - 16 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

The Next Semiconductor Revolution
By Ed Sperling - 15 Jan, 2019 - Comments: 0

What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

Manufacturing Bits: Jan. 14
By Mark LaPedus - 14 Jan, 2019 - Comments: 0

Tracking cell movement Using a technology called cyro-electron microscopy (cryo-EM), Sanford Burnham Prebys Medical Discovery Institute (SBP) and the University of North Carolina at Chapel Hill (UNC-Chapel Hill) have gained a better understanding of how cells move in living organisms. Cells, the basic building blocks of living things, need to move. Moving cells help enable embryonic develop... » read more

Striking the Right Chord for Chiplet Integration
By Kandou Bus - 14 Jan, 2019 - Comments: 0

The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signali... » read more

Vapor-Deposited Octadecanethiol Masking Layer on Copper for Selective Hf3N4 ALD
By Veeco - 14 Jan, 2019 - Comments: 0

Full title: Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry Journal of Vacuum Science & Technology A 36, 031605 (2018); Authors: Laurent Lecordiera, Veeco Instruments Sebastiaan Herregods and Silvia Armini, IMEC Area-selective atomic layer deposition (AS-ALD) h... » read more

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