category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: June 7
By Mark LaPedus - 07 Jun, 2016 - Comments: 0

Intel’s spintronic spectrometer Intel and Stanford University have presented the first results for a technology called a ferromagnetic resonance (FMR) spectrometer. Initially invented and developed by the National Institute of Standards and Technology (NIST), FMR examines the properties of materials for spintronic-based memories. Today’s DRAMs store binary data in tiny capacitors. I... » read more

Overcoming RC In Memory Scaling
By Rajkumar Jakkaraju - 06 Jun, 2016 - Comments: 0

In a memory device, Ohmic contacts (semiconductor-to-metal interfaces) connect the active region and the metal wiring. To achieve rapid and maximal charge transmission across the Ohmic contact, a low-resistivity material is used. Low-resistivity Co silicide has been adopted as the industry standard for this purpose; its effectiveness relies on the deposition of a sufficiently thick layer to for... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jun, 2016 - Comments: 0

Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

Manufacturing Bits: May 31
By Mark LaPedus - 31 May, 2016 - Comments: 0

Superconducting magnets The National High Magnetic Field Laboratory (MagLab) has broken another world’s magnet record. This time, MagLab broke a record for a high-temperature superconducting (HTS) coil operating inside a high-field resistive magnet. With the technology, the agency achieved a magnetic field of 40.2 teslas. The previous record was 35.4 teslas. Tesla, or T, is the measuremen... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 May, 2016 - Comments: 0

Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

The Trouble With MEMS
By Ed Sperling - 25 May, 2016 - Comments: 0

The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number of reasons for that restraint. Microelectromechanical systems are difficult to design, manufacture and test, which initially fueled optimism in the MEMS ecosystem that this market would command the same kinds of premiums that analo... » read more

RC Delay: Bottleneck To Scaling
By Rajkumar Jakkaraju - 24 May, 2016 - Comments: 1

R = resistance — the difficulty an electrical current has in passing through a conducting material. C = capacitance — the degree to which an insulating material holds a charge. RC delay = the delay in signal speed through the circuit wiring as a result of these two effects. RC delay is important because it can become a significant obstacle to continued downward scaling of logic and... » read more

Manufacturing Bits: May 24
By Mark LaPedus - 24 May, 2016 - Comments: 2

Microbunching EUV Researchers at the SLAC National Accelerator Laboratory have provided a status report on its ongoing efforts to develop a steady-state microbunching (SSMB) technology. SSMB is a technology used within a storage ring, which is a large-scale, circular particle accelerator. An SSMB mechanism produces a high-power radiation source within the ring. This, in turn, could enable a... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy