category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Manufacturing Bits: Aug. 31
By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

How Chips Will Change Health Care
By Ed Sperling - 25 Aug, 2021 - Comments: 0

Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Inside Intel’s Ambitious Roadmap
By Mark LaPedus and Ed Sperling - 23 Aug, 2021 - Comments: 2

Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of that discussion. SE: Intel recently disclosed its new logic roadmap. Beyond Intel 3, the company is working on Intel 20A. Wit... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Aug, 2021 - Comments: 0

Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

What’s Ahead For DRAM, NAND?
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

For the last year, the semiconductor industry has been in the midst of a boom cycle. But if you look close enough, there are mixed signals in the market, especially in memory. Still, it’s a banner year for semiconductors. In total, the semiconductor market is expected to grow by 18.1% in 2021, according to Semico Research. That compares to 6.6% growth in 2020, according to Semico. Today... » read more

Advancing To The 3nm Node And Beyond: Technology, Challenges And Solutions
By Michael Hargrove - 19 Aug, 2021 - Comments: 0

It seems like yesterday that finFETs were the answer to device scaling limitations imposed by shrinking gate lengths and required electrostatics. The introduction of finFETs began at the 22nm node and has continued through the 7nm node. Beyond 7nm, it looks like nanosheet device structures will be used for at least the 5nm and probably the 3nm nodes. The nanosheet device structure is the brainc... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Optimizing VSB Shot Count For Curvilinear Masks
By Jan Willis - 19 Aug, 2021 - Comments: 0

The increased photomask write time using a variable-shape e-beam (VSB) writer has been a barrier to the adoption of inverse lithography technology (ILT) beyond the limited usage for hot spots. The second installment of this video blog looked at the challenge in depth. In this five-minute panel video with industry luminaries, Ezequiel Russell describes the collaborative study between his company... » read more

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