category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Bending The Rules With Curvilinear Technology
By Jan Willis - 05 Apr, 2021 - Comments: 0

What have been the historical hurdles for curvilinear ILT? Danping Peng, director at TSMC, reflected on his early involvement in the development of ILT and the three major hurdles encountered while at Luminescent during a panel discussion with industry experts at the eBeam Initiative’s annual event during the 2021 SPIE Advanced Lithography Conference. Among the topics covered, the panel di... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

Manufacturing Bits: March 30
By Mark LaPedus - 30 Mar, 2021 - Comments: 0

Open access quantum computing Sandia National Laboratories has begun offering an open access program for its quantum computing testbed. Sandia will enable researchers to explore a range of new technologies, such as chemistry, materials science and mathematics, using its so-called Quantum Scientific Computing Open User Testbed (QSCOUT). Quantum computers promise to solve problems that are to... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Mar, 2021 - Comments: 0

Chipmakers Intel has re-entered the foundry business after a failed attempt several years ago. In its new efforts, Intel is establishing a new standalone business unit called Intel Foundry Services. As part of those efforts, Intel has announced plans to build two new fabs in Arizona. This build-out represents an investment of approximately $20 billion. “INTC hosted a strategy update with ... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Accelerate Custom Layout Using Custom Compiler’s User-Defined Device (UDD)
By Synopsys - 24 Mar, 2021 - Comments: 0

In this 7th video of the series, Kai Wang, Director of Engineering at Synopsys, discusses in-design electrical analysis, and why it is critical to use signoff engines to check and fix resistance, capacitance and electromigration issues during layout. Click here to access this video whitepaper. » read more

Manufacturing Bits: March 23
By Mark LaPedus - 23 Mar, 2021 - Comments: 0

Measuring acceleration The National Institute of Standards and Technology (NIST) has developed a new and better way to measure acceleration. NIST has developed an optomechanical accelerometer, a technology that has more resolution and bandwidth than conventional accelerometers. Optomechanical accelerometers uses laser light of a known frequency to measure acceleration. With the technology, ... » read more

Semiconductor CapEx To Grow 13.0% In 2021
By Adrienne Downey - 23 Mar, 2021 - Comments: 0

Semiconductor capital expenditures grew 9.2% in 2020 to US$112.1 billion. This is $14.1 billion higher than our spring 2020 forecast, and $3.2 billion higher than our fall 2020 forecast. As shown in the graph below, the total 2020 CapEx was $9.4 billion larger than the $102.7 billion spent in 2019. Semico is forecasting 2021 CapEx to reach $127 billion, an increase of 13.0%. Source: Semico... » read more

Washington Takes Key Steps to Bolster U.S. Semiconductor Manufacturing And Supply Chains
By Kimberly Ekmark - 23 Mar, 2021 - Comments: 0

Recent semiconductor supply chain constraints have drawn the attention of Washington policymakers at every level. Exasperated by the global pandemic, customers of semiconductor manufacturers have sounded the alarm about the chip shortage and the downstream consequences for end-user companies and consumers. Global automakers have suffered the brunt of the impact, shuttering factories and slashin... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

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