Using OCD To Measure Trench Structures In SiC Power Devices


You don’t have to be a dedicated follower of the transportation industry to know it is in the early stages of a significant transition, away from the rumbling internal combustion engine to the quiet days of electric vehicles. The signs of this transition are right there on the streets in the form of electric-powered buses, bikes and cars. The road to our electric future is before us, but we w... » read more

Adaptive Test Ramps For Data Intelligence Era


Widely available and nearly unlimited compute resources, coupled with the availability of sophisticated algorithms, are opening the door to adaptive testing. But the speed at which this testing approach is adopted will continue to vary due to persistent concerns about data sharing and the potential for IP theft and data leakage. Adaptive testing is all about making timely changes to a test p... » read more

Hidden Costs And Tradeoffs In IC Quality


Balancing reliability against cost is becoming more difficult for semiconductor test, as chip complexity increases and devices become more domain-specific. Tests need to be efficient and effective without breaking the bank, while also ensuring chips are of sufficient quality for their specific application. The problem is that every new IC device adds its own set of challenges, from smaller f... » read more

Bridging The Connectivity Gap: Unraveling The Complexities Of Wireless Standard Deployments


By Alejandro Escobar Calderon and John Ye In the fast-paced world of technological evolution, the deployment of wireless standards has been touted as the gateway to a connected future. The promise of lightning-fast wireless connectivity has been a driving force behind the relentless pursuit of cutting-edge standards such as 4G, 5G, and new network architectures like Open RAN (O-RAN). However... » read more

True Zero Trust Combats IC Manufacturing Security Challenges


The semiconductor manufacturing industry is facing a host of unprecedented technology and security challenges. A common catchphrase these days is that “data is the new oil.” Data is everywhere, in everything we do, and there is both good and bad associated with this trend. Data everywhere creates new security issues that need to be addressed to protect the integrity of your information and ... » read more

AI-Driven Test Optimization Solves Semiconductor Test Costs And Design Schedules


Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis, and corresponding decision making that are otherwise limited by human abilities. Therefore, complex challenges in semiconductor design, test and manufacturing are a perfect match for AI. The... » read more

FTIR On Earth, Mercury In Focus


On early hours on 19th October 2018 at Guiana Space Centre in Kourou in French Guiana an Ariane 5 rocket successfully launched the BepiColombo mission. It started its 7 years journey to Mercury. The joined mission of the European Space Agency (ESA) and the Japan Aerospace Exploration Agency (JAXA) was named in honor of Giuseppe “Bepi” Colombo, an Italian scientist who studied Mercury and fi... » read more

Deep Learning For Corner Fill Inspection


When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. But there are some challenging applications. Some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. Given an image containing a cat, a dog and a d... » read more

Partnership To Improve Semiconductor Quality And Yield


By Eran Rousseau (NI) and Eli Roth (Teradyne) The semiconductor industry is notorious for its high production costs and the critical importance of maintaining impeccable product quality. As technology advances and consumer expectations rise, semiconductor companies face constant pressure to meet these cost and quality goals while also delivering cutting-edge products. Traditionally, the s... » read more

Inspection, Metrology Issues In Advanced Packages


Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at O... » read more

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