category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Keeping The Lights On: How Digital Twins And Smart Semiconductor Management Power Our 24/7 World
By Lee Harrison - 11 Nov, 2025 - Comments: 0

Hey there, tech enthusiasts and digital pioneers! Have you ever stopped to think about the tiny, intricate components that keep our modern world humming? From the advanced safety features in your car to the massive data centers powering AI, semiconductors are truly the unsung heroes. But what happens when these tiny titans face immense pressure, like the non-stop demands of AI workloads? That's... » read more

Beyond The Bottleneck: 3 Breakthroughs In High-Throughput Connector Testing
By Reagan Oliver - 11 Nov, 2025 - Comments: 0

By Reagan Oliver and Jesse Ko Ensuring the quality of mass-produced electronic connectors without creating a production bottleneck remains a persistent challenge in manufacturing. As demand for speed and reliability increases, innovative testing solutions are emerging to meet this need head-on. This article breaks down three key breakthroughs in modern connector testing technology based on a... » read more

AI In Test Analytics: Promise Vs. Reality
By Gregory Haley - 11 Nov, 2025 - Comments: 0

The semiconductor industry is increasingly turning to artificial intelligence as the solution for increasing complexity in test analytics, hoping algorithms can tame the growing flood of production data. The need to extract actionable insight from that torrent is pressing. AI/ML (AI) models promise to find correlations buried in multidimensional datasets, predict failures before they occur, and... » read more

Through The Glass: Why The Rapid Development Of TGV Demands Rigorous Analysis
By Onto Innovation - 11 Nov, 2025 - Comments: 0

The drive for increased performance is enticing some advanced packaging manufacturers to transition from traditional organic substrates to glass core substrates, a switch that comes with numerous benefits. Compared to organic substrates, glass core offers superior mechanical strength, is better suited for large package sizes, provides improved electrical properties, and has the ability to meet ... » read more

AI Memory: Enabling The Next Era Of High-Performance Computing
By Tadashi Oda - 11 Nov, 2025 - Comments: 0

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in high-bandwidth memory (HBM). However, as AI models grow in complexity—from large language models (LLMs) to real-time inference applications—the need for faster, higher-bandwidth, and energy-effici... » read more

New Rules Put The Squeeze On Semiconductor Gray Market
By Anne Meixner - 11 Nov, 2025 - Comments: 0

The shift toward chiplets and multi-die assemblies is forcing big changes in the global supply chain, including much tighter cooperation between companies and governments to ensure the authenticity and quality of semiconductor parts. The chip industry has been looking to digital certificates as the best means of reducing counterfeiting and ensuring consistent quality for some time. The probl... » read more

Standardization Of HDMs For Hierarchical CDC And RDC Analysis
By Siemens EDA - 11 Nov, 2025 - Comments: 0

Currently hierarchical data models (HDM) must be generated with the same EDA tool that customers will use to consume the HDM for CDC and RDC analysis at the SoC level. To resolve this problem a CDC Working Group was created within the Accellera organization. The goal of this Working Group is to create a standard format for HDMs so the models can be consumed by any EDA tool irrespective of the s... » read more

Thermal Sensing Headache Finally Over For 2nm And Beyond
By Nir Sever - 11 Nov, 2025 - Comments: 0

Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing compromises power management, reliability, processing speed, and lifespan, leading to issues like electromigration, hot carrier injection, and even thermal runaway. Unfortunately, precise thermal monitoring reached an inflect... » read more

HBM Leads The Way To Defect-Free Bumps
By Laura Peters - 11 Nov, 2025 - Comments: 0

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and foundries must simultaneously handle multi-layer chip stacking, die warpage, and shorter product lifecycles that are shrinking from two years down to just one. But perhaps the most formidable c... » read more

Designing for Reliability, Availability, and Serviceability Across the System Lifecycle
By Synopsys - 11 Nov, 2025 - Comments: 0

Discover how embedding advanced monitoring and analytics directly into silicon is redefining system management across the entire lifecycle. This white paper examines the evolving role of reliability, availability, and serviceability (RAS) in modern electronic systems, highlighting why proactive resilience has become just as critical as raw performance. It explores strategies for reducing costly... » read more

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