category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Metrology Digs Deep To Produce Next-Generation 3D NAND
By Laura Peters - 09 Dec, 2025 - Comments: 1

Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions shrinking from 18 months to every 12 months, chipmakers are constantly innovating to enable this prodigious scaling pace. 3D NAND technology is a core ingredient in mobile phones, solid-state dr... » read more

Overview Of Radiation Dose During X-ray Inspection Of Electronics
By Nordson Test And Inspection - 09 Dec, 2025 - Comments: 0

X-ray imaging of semiconductor and electronic devices is an invaluable tool; enabling non-invasive sub-surface inspection, identification of defects and measurement of critical dimensions. Figure 1 shows a schematic and description of a typical X-ray inspection system for electronics and semiconductor devices. Unfortunately, semiconductor devices are sensitive to sustained radiation dose, which... » read more

Beyond The Core: Tackling System-Wide Debugging For Complex SoCs
By Francisca Tan - 09 Dec, 2025 - Comments: 0

The world of System-on-Chips (SoCs) is evolving – with the advancement of generative AI, the increasing demand for high-performance compute, and the innovative shift towards multi-chiplet architectures, system complexity is advancing at an increased pace. And with complexity comes an even greater challenge: debugging complexity. Silent data corruption, elusive timing-sensitive bugs, and i... » read more

Enhancing CMP Process Control with Intelligent Line Monitoring & Integrated Metrology
By Onto Innovation - 09 Dec, 2025 - Comments: 0

New logic transistor designs, 3D NAND stacking, and DRAM integration introduce more CMP layers and tighter process windows. Traditional metrology approaches struggle to keep pace, especially with the need for high sampling rates, multiple control zones, and improved signal-to-noise ratios. Onto Innovation’s Intelligent Line Monitoring & Control with Integrated Metrology offers a new appro... » read more

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing
By Anne Meixner - 09 Dec, 2025 - Comments: 0

Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

The Growing Need For Collaboration Across The Semiconductor Industry
By PDF Solutions - 09 Dec, 2025 - Comments: 0

Abstract: AI-driven collaboration is becoming essential for the semiconductor industry to manage its increasingly complex global supply chain. This new model facilitates real-time data sharing and multi-party orchestration, moving beyond conventional, crisis-driven interactions. By leveraging a secure data infrastructure, automated orchestration, and AI agents, companies can automate busines... » read more

Tackling Chip Complexity With Integrated System-Level Test Solutions
By Davette Berry - 09 Dec, 2025 - Comments: 0

As the sophistication of semiconductors continues to grow, so does the need for system-level test (SLT) in production to ensure that high-performance processors, chiplets, and other advanced devices function as expected in real-world environments. Once seen primarily as a fallback to catch what traditional automated test equipment (ATE) missed, SLT has now become a mission-critical step for val... » read more

DFT Shifts Further Left
By Ed Sperling - 08 Dec, 2025 - Comments: 0

Design for test is now an essential part of all advanced-node designs, but DFT dynamics are changing with the move to multi-die assemblies. More components, including chiplets, make it imperative to analyze more data earlier. Jeff Meyer, product manager for Tessent logic test at Siemens EDA, talks about how to reduce the cost of this analysis and the time it takes to do it, how much can be shif... » read more

Improving IC System Quality And Performance
By Ed Sperling - 12 Nov, 2025 - Comments: 0

Ensuring that multi-die assemblies and advanced SoCs will work as expected from time zero to the end of their lifecycle adds new challenges for chipmakers and their customers. Chips are being run harder, hotter, and for longer periods of time, often in unique configurations and with customized workloads. Alex Burlak, vice president of test and analytics at proteanTecs, talks about how to identi... » read more

AI-Driven Collaboration: Transforming The Semiconductor Industry’s Operating Model
By Christophe Begue - 11 Nov, 2025 - Comments: 0

The semiconductor industry stands at an inflection point. As the sector pushes into 3D architectures, advanced packaging, and heterogeneous integration, the traditional model of stage-gate, crisis-driven collaboration is reaching its limits. John Kibarian, CEO of PDF Solutions, recently outlined a vision for AI-driven collaboration at the SEMICON West CEO Summit, a fundamental reimagining of... » read more

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