category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms
By PDF Solutions - 13 Jan, 2026 - Comments: 0

Demand for advanced computing is robust, driven by AI, cloud technologies, and widespread electrification of the economy. As Moore’s Law slows, the industry is pivoting toward innovative approaches—exploring 3D architectures, chiplets, and sophisticated hybrid packages. Concurrently, the semiconductor landscape is becoming increasingly global, with advanced devices now relying on integratin... » read more

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding
By Bryon Moyer - 13 Jan, 2026 - Comments: 0

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s merely a postponement, not a cancellation. HBM has been in high demand for AI in data centers — especially for training. Data movement dominates energy consumption, and high-bandwidth memories... » read more

High-Throughput Image Sensors: Smart Testing Powers Progress
By Alexander Metzdorf - 13 Jan, 2026 - Comments: 0

In the race to produce higher resolution image sensors—now pushing beyond 500 megapixels—the industry faces significant challenges. These sensors aren’t just capturing more pixels; they’re handling massive streams of data, validating intricate on-chip AI functions, and doing it all at breakneck speeds. For manufacturers, the challenge is as unforgiving as it is critical: test more compl... » read more

Scalable End-To-End Test Solutions For Today’s Complex SoCs
By Srikanth Venkat Raman - 17 Dec, 2025 - Comments: 0

By Srikanth Venkat Raman and Sri Ganta Today’s highly complex and large system on chip (SoC) devices and systems present many challenges to be addressed from manufacturing tests to the field while meeting stringent requirements for test costs, test quality, yield, debug, and turn-around-times. Scalable and efficient end-to-end test solutions that scale to large and complex SoC design cores... » read more

Tracing The Equipment Connectivity Journey
By Bob Reback - 09 Dec, 2025 - Comments: 0

The semiconductor industry has undergone a dramatic transformation from the early days of manual integration to today's AI-driven collaboration with equipment connectivity at the heart of this evolution. Understanding these trends is crucial for any organization looking to leverage data for improved efficiency, reliability, and competitive advantage. This blog explores milestones and emergin... » read more

Smaller Geometries, Bigger Demands: The Role Of OCD In GAA Logic And Vertical Gate DRAM Process Control
By Jiangtao Hu - 09 Dec, 2025 - Comments: 0

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief among these innovations: gate-all-around (GAA) logic transistor and vertical gate (VG) DRAM, two device architectures that promise higher performance, improved power efficiency, and greater scalabil... » read more

Adaptive Test Gaining Ground For HPC And AI Chips
By Gregory Haley - 09 Dec, 2025 - Comments: 0

Adaptive test is starting to gain traction for high-performance computing and AI chips as test programs that rely on static limits and fixed test sequences reach their practical limits. The growing complexity of multi-die assemblies and power delivery, along with increased stresses, are forcing a shift toward real-time, data-driven optimization at the test cell. “It’s the same old pro... » read more

Invisible Interfaces: The Hidden Challenge Behind Every Great Image Sensor
By Alexander Metzdorf - 09 Dec, 2025 - Comments: 0

When you snap a photo on your phone or rely on a car’s camera for lane detection, you’re trusting an unseen network of technologies to deliver or interpret image data flawlessly. But behind the scenes, the interface between the image sensor and its processor is doing the heavy lifting, moving megabtyes of data without error or delay. While much of the industry conversation focuses on adv... » read more

Resilient And Optimized GenAI Systems
By Ziv Paz - 09 Dec, 2025 - Comments: 1

AI and data center systems are being pushed to their limits, with soaring complexity, nonstop inference workloads, and rising energy demands. Addressing these pressures requires more than incremental improvements, it calls for collaboration across the ecosystem. That’s why proteanTecs has joined forces with Arm, bringing our real-time monitoring technology into Arm’s Neoverse Compute Subsys... » read more

Boosting Production Performance: Ensuring Only Known-Good Sockets Enter Your Line
By Jesse Ko - 09 Dec, 2025 - Comments: 0

Efficient, stable, and high-yield semiconductor production depends on one often-overlooked factor: the health of your test sockets. In many factories, socket maintenance and inspection practices haven't kept pace with the demands of today’s high-density, high-speed packages. The result? Hidden marginal pins, unexpected downtime, multisite yield variation, and inflated manufacturing costs. ... » read more

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