category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Chiplets Add More Inspection And Test Steps
By Anne Meixner - 10 Feb, 2026 - Comments: 0

Key Takeaways Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is forcing changes in how chips are tested and ... » read more

Picosecond Ultrasonics: An Advanced Technology Utilized for Process Control of SiCr Thin Film Resistors
By Onto Innovation - 10 Feb, 2026 - Comments: 0

The bipolar-CMOS-DMOS (BCD) process is an advanced semiconductor technology integrating bipolar, CMOS, and DMOS devices onto a single chip, providing a compact, high-performance platform for the integration of analog, digital, and power circuitry. Thin-film resistors are employed to ensure precise resistance values and minimal temperature coefficients (TCR), thereby delivering enhanced accuracy... » read more

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

A Clear Advantage: Precision Glass Carrier Inspection For AI And HPC Markets
By Jason Lin - 13 Jan, 2026 - Comments: 0

If you’ve been following the evolution of advanced packaging, you know that the industry is pushing boundaries like never before. From high-performance computing to industry-upending AI devices, the demand for smaller, faster, and more powerful chips is driving innovation at every level. One of the unsung heroes in this transformation: Glass carriers. These carriers are becoming essential ... » read more

Semiconductor Manufacturing In The AI Era
By Christophe Begue - 13 Jan, 2026 - Comments: 0

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the semiconductor industry at a pivotal inflection point, one driven by explosive AI demand but constrained by unprecedented manufacturing complexity. His central message: the path to a trillion-dollar semiconductor industry by 2030 requires fundamentally rethinking how manufacturers c... » read more

Robust Dynamic Voltage Droop Mitigation And Power Management
By Graham Woods - 13 Jan, 2026 - Comments: 1

Power management is one of the keys for developing successful semiconductors products. There are virtually no applications for which power consumption is not a concern. Many creative solutions have been developed to reduce and manage power. Making these schemes work robustly in real-world conditions can be a challenge. This post considers widely used methods—voltage droop/glitch detection and... » read more

Early Zone Correction for Enhanced Overlay Precision in Next-Generation FOPLP Lithography
By Onto Innovation - 13 Jan, 2026 - Comments: 0

AI chiplet architectures are driving advanced IC substrates (AICS) toward larger panels, finer line/space, and much tighter overlay budgets. This study presents a lithography strategy that combines ultra-large exposure field and fine-resolution imaging with algorithmic early zone correction (EZC) to reduce alignment-solution errors, the largest item in the lithography overlay budget. In this st... » read more

Secure Data Sharing Becoming Critical For Chip Manufacturing
By Laura Peters - 13 Jan, 2026 - Comments: 0

Semiconductor companies increasingly need to share data to solve problems faster, boost yield, and trace the root cause of failed devices. But to make that work, companies need assurances that their data will be secure, free from data leaks that could result in the loss of valuable IP. Data sharing is becoming critical at leading device nodes, where process variability is starting to consume... » read more

Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging
By Bruker - 13 Jan, 2026 - Comments: 0

Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are critical for surface characterization and process optimization. AFM delivers localized, high-resolution surface measurements, while AFP provides complementary large-area topography scans that ... » read more

Why Scan Diagnosis Should Be Part Of Every Fabless Company’s Yield Playbook
By Jayant D'Souza - 13 Jan, 2026 - Comments: 0

A fabless semiconductor company's world spins around two things, pushing design differentiation and getting those designs to market quickly and profitably. Yield isn’t just a manufacturing KPI. It's a business lever. And one of the most under-used levers in modern fabs is scan diagnosis, the practice of turning deterministic test infrastructure and failing test data into precise and action... » read more

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