As semiconductor manufacturers push the boundaries of performance and functionality—driven by high-performance computing and AI applications—chemical mechanical planarization (CMP) processes increase in intensity complexity.
New logic transistor designs, 3D NAND stacking, and DRAM integration introduce more CMP layers and tighter process windows. Traditional metrology approaches struggle to keep pace, especially with the need for high sampling rates, multiple control zones, and improved signal-to-noise ratios. Onto Innovation’s Intelligent Line Monitoring & Control with Integrated Metrology offers a new approach to CMP process control. By leveraging data feedforward from standalone metrology tools to integrated metrology systems, this solution enables real-time, AI-driven process optimization.
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