Using Deep Data For Improved Reliability Testing


Reliability testing always has been a challenge for semiconductor companies, but it’s becoming much more difficult as devices continue to shrink, as they’re integrated together in advanced packages, and as they’re utilized under different conditions with life expectancy that varies by application and use case. Nir Sever, senior director of business development at proteanTecs, and Luca Mor... » read more

Testing ICs Faster, Sooner, And Better


The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

Closing The Test And Metrology Gap In 3D-IC Packages


The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

Fingerprinting Chips For Traceability


Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

A Bare Wafer Mystery: Inspecting For Back, Edge, And Notch Defects In Advanced Nodes


It is no mystery that the semiconductor industry is always advancing, with specifications becoming increasingly stringent as defects become increasingly more difficult to discover. This is especially true in the case of the most advanced nodes, where ever-smaller flaws and deformities can result in a killer defect. To solve this More than Moore mystery, you do not need to employ the detectiv... » read more

Unleashing The Power Of Test Through Data


In the relentless pursuit of technological innovation, test engineers find themselves facing ever-increasing pressures to deliver flawless products at an unprecedented pace. From the rapid evolution of autonomous vehicles to the advent of 5G and beyond, the demands on engineering teams continue escalating. While organizations strive to optimize their testing processes, the need for efficient te... » read more

Mission Profile Analytics For The Automotive Industry


The automotive industry is undergoing a major transformation with the rise of electrification, connectivity, and autonomous driving capabilities fueling the need for a greater number of more advanced semiconductors. The associated regulatory expectations are also creating challenging safety and reliability requirements for automotive-grade silicon that need to be understood and managed over a w... » read more

Deploying Cutting-Edge Adaptive Test Analytics Apps


By Ken Butler, Advantest, and Guy Cortez, Synopsys Semiconductor test challenges abound in this era of AI. As such, semiconductor test engineering is increasingly moving towards fully adaptive test where each device receives the “right” test content to assess its correctness. Advantest and Synopsys have partnered to provide new cutting-edge real-time adaptive test applications at the te... » read more

Using In-Chip Monitoring And Deep Data Analytics For High Bandwidth Memory (HBM) Reliability And Safety


Since its introduction in 2014, High Bandwidth Memory (HBM) has been poised to address the growing demand for high-performance, high capacity, and low latency memories required by High-Performance Computing (HPC), high-performance graphic processors (GPU), and artificial intelligence (AI). Since then, bandwidth and capacity requirements have increased with each new generation: HBM2, HBM2e and n... » read more

Achieving Automotive Reliability With Advanced Monitoring Solutions


In today's automotive landscape, the integration of advanced software and hardware has transformed vehicles into complex data-driven machines. Sensors like cameras, radars, and lidars constantly monitor the vehicle's surroundings, feeding data to electronic control units that enable advanced driver assistance features like adaptive cruise control, lane-keeping assistance, and collision avoid... » read more

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