Sustainable Products For A More Sustainable World


Teradyne’s sustainability journey began three decades ago with a focus on minimizing the environmental impact of our buildings and infrastructure, as outlined in our two part blog series (check out part one and part two). This effort also includes a focus on making our products more sustainable. In this blog, learn how Teradyne’s products and efforts are contributing to a more sustainabl... » read more

Application For Non-Destructive Inspection


IC chip internal measurement We attempted to apply the Hadatomo Z photoacoustic microscope for non-destructive inspection. One of the features of the HadatomoTM Z is simultaneous measurement using photoacoustic imaging and ultrasound imaging. By using an ultrasonic sensor with cen- ter frequency of 60 MHz, high-resolution imaging is possible. Photoacoustic imaging is a method to re... » read more

FMEDA Powered Safety Verification Methodology For Semiconductors


Today’s automobiles require increasingly complex systems and chips, adherence to functional safety processes has become essential during the design development phase. The intricate nature of  semiconductors used in automotive applications is driving the need for functional safety throughout the entire supply chain, reaching not just the automobile manufacturers but also the semiconductor des... » read more

Predictive And Prescriptive Maintenance In The Context Of Automotive Functional Safety


The ever-changing landscape of advanced SOCs reshape traditional approaches of automotive functional safety (FuSa). Electrification (EV), connectivity, driver-assistance (ADAS), and software-defined vehicles (SDV) have ushered in the era of mega-functionality and scale. This paper discusses the paradigm shifts and required methodologies to navigate the surge of innovation and ensure the utmost ... » read more

Week In Review: Semiconductor Manufacturing, Test


China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must obtain a license from China’s Ministry of Commerce. China produces 60% of the worldwide supply of germanium and 80% of the world’s gallium, both of which have to be processed from other mate... » read more

Reducing Chip Test Costs With AI-Based Pattern Optimization


The old adage “time is money” is highly applicable to the production testing of semiconductor devices. Every second that a wafer or chip is under test means that the next part cannot yet be tested. The slower the test throughput, the more automatic test equipment (ATE) is needed to meet production throughput demands. This is a huge issue for chip producers, since high pin counts, blazingly ... » read more

Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections


All great voyages must come to an end. Such is the case with our series on the challenges facing the manufacturing of advanced IC substrates (AICS), the glue holding the heterogeneous integration ship together. In our first blog, we examined how cumulative overlay drift from individual redistribution layers could significantly increase overall trace length, resulting in higher interconnect res... » read more

Mission-Critical Devices Drive System-Level Test Expansion


System-level testing is becoming essential for testing complex and increasingly heterogeneous chips, driven by rising demand for reliable parts in safety- and mission-critical applications. More and more chip manufacturers are jumping on the SLT bandwagon for high-volume manufacturing (HVM) of these devices. Unlike ATE and packaged device testing, SLT mimics actual semiconductor system opera... » read more

How Software Can Help Redefine Semiconductor Validation


The rate of technological advancement is increasing faster than ever before. Although the demands for meeting aggressive time-to-market requirements and innovating at warp speed are not new, they are continuing to accelerate. To cut costs without compromising product quality, engineers are now expected to test new designs more rapidly at various stages of development. Even though many organizat... » read more

Ditch The Glitch


To support the ever-growing performance demands of cutting-edge applications like automotive and hyperscaler, SoC complexity continues to increase. The emergence of multi-die technology has also compounded this complexity. To keep up with these demands, design-for-test (DFT) logic must also evolve to ensure greater levels of test robustness and silicon health. The “Shift left” concept which... » read more

← Older posts Newer posts →