category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Deep Learning For Corner Fill Inspection
By Nordson Test And Inspection - 08 Feb, 2024 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. But there are some challenging applications. Some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. Given an image containing a cat, a dog and a d... » read more

Partnership To Improve Semiconductor Quality And Yield
By Eli Roth - 08 Feb, 2024 - Comments: 0

By Eran Rousseau (NI) and Eli Roth (Teradyne) The semiconductor industry is notorious for its high production costs and the critical importance of maintaining impeccable product quality. As technology advances and consumer expectations rise, semiconductor companies face constant pressure to meet these cost and quality goals while also delivering cutting-edge products. Traditionally, the s... » read more

Inspection, Metrology Issues In Advanced Packages
By Gregory Haley - 08 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at O... » read more

Yield Tracking In RDL
By Ed Sperling - 07 Feb, 2024 - Comments: 0

Yield is a much bigger issue when it comes to panel-level packages, which may contain up to 24 RDL layers. Just finding the defects is a massive challenge, let alone understanding how they will impact the entire device. Many of these advanced packages are being used in data centers for generative AI, and killer defects caused by bridges and opens can cause serious problems. What happens, for in... » read more

From Data To Safety On-The-Road Hardware Health Monitoring
By proteanTecs - 07 Feb, 2024 - Comments: 0

The automotive industry is currently experiencing a transformation driven by electrification, connectivity, and autonomous driving. Vehicles require extensive computational capabilities and generate massive amounts of data. Future cars will embrace new architectures, becoming software-defined "computers on wheels" capable of hosting advanced applications, machine learning algorithms, and contin... » read more

ML-Assisted IC Test Binning With Real-Time Prediction At The Edge
By PDF Solutions - 07 Feb, 2024 - Comments: 0

IC Test is a critical part of semiconductor manufacturing and proper die binning and material disposition has an important impact on the overall yield and on the process monitoring and failure mode diagnostics. Edge analytics are becoming an increasingly important aspect of die disposition. By intercepting parts in real-time at the wafer test step, we can save downstream processing needs. In th... » read more

Reducing Power In Data Centers
By Ed Sperling - 16 Jan, 2024 - Comments: 0

The rollout of generative AI, coupled with more data in general, is requiring data centers to run servers harder and longer. That, in turn, is generating more heat and accelerating aging, and to ensure these systems continue working over their projected lifetimes, chipmakers are building extra margin into chips. That increases the amount of energy required to run and cool them, and it can short... » read more

Glass Substrates Gain Foothold In Advanced Packages
By Gregory Haley - 09 Jan, 2024 - Comments: 2

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Pressure Builds On Failure Analysis Labs
By Laura Peters - 09 Jan, 2024 - Comments: 0

Failure analysis labs are becoming more fab-like, offering higher accuracy in locating failures and accelerating time-to-market of new devices. These labs historically have been used for deconstructing devices that failed during field use, known as return material authorizations (RMAs), but their role is expanding. They now are becoming instrumental in achieving first silicon and ramping yie... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

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