category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Metrology Options Increase As Device Needs Shift
By Laura Peters - 10 Jan, 2023 - Comments: 1

Semiconductor fabs are taking an ‘all hands on deck’ approach to solving tough metrology and yield management challenges, combining tools, processes, and other technologies as the chip industry transitions to nanosheet transistors on the front end and heterogenous integration on the back end. Optical and e-beam tools are being extended, while X-ray inspection is being added on a case-by-... » read more

Looking Inside Of Chips
By Ed Sperling - 10 Jan, 2023 - Comments: 0

Shai Cohen, co-founder and CEO of proteanTecs, sat down with Semiconductor Engineering to talk about how to boost reliability and add resiliency into chips and advanced packaging. What follows are excerpts of that conversation. SE: Several years ago, no one was thinking about on-chip monitoring. What's changed? Cohen: Today it is obvious that a solution is needed for optimizing performanc... » read more

Emerging Technologies Are Driving System Level Test Adoption
By Natalian Z. Der - 10 Jan, 2023 - Comments: 0

With the size of semiconductor transistors decreasing and chip complexity increasing exponentially, semiconductor test has become essential to ensuring that only high-quality products go to market. With the introduction of more rigorous acceptable quality level (AQL) certifications, test methods must constantly evolve to meet these standards, and system level test (SLT) and traditional test... » read more

Reducing Simulation Regression Turnaround Time With Dynamic Performance Optimization
By Synopsys - 10 Jan, 2023 - Comments: 0

No single step in the development of semiconductor devices is more sensitive to speed than functional simulation. A modern system-on-chip (SoC) design simulates billions of cycles of operation in the process of completing the verification plan and achieving coverage goals. To validate full system functionality, many of these simulations include running code on one or more embedded processors. E... » read more

IR Laser Imaging Is Rapidly Changing IR Microscopy
By Bruker - 10 Jan, 2023 - Comments: 0

IR laser imaging is finally being commercialized into smart analytical equipment. New applications continue to emerge and yield massive advantages, thanks to the direct combination with FT-IR technology. The application notes below provide valuable insights into three applications of IR laser imaging: Tissue imaging Surface analysis Forensic science Click here to read more. » read more

Industrial Solutions For Machine-Learning-Enabled Yield Optimization And Test
By Sonny Banwari - 10 Jan, 2023 - Comments: 0

This article summarizes the content of a paper developed and presented by Advantest at ETS 2022. By Sonny Banwari and Matthias Sauer According to market research firm Gartner, Inc., in assessing the completion rate of data science projects, as well as the bottom-line value they generate for their companies, only between 15 and 20 percent of these projects are ever completed. Moreover, of ... » read more

System Level Test — A Primer: White Paper
By Teradyne - 10 Jan, 2023 - Comments: 0

As semiconductor geometries become smaller and greater complexity is pushed into chips or packages, System Level Test (SLT) is becoming essential. Peter Reichert, System Architect for Teradyne’s System Level Test division discusses what System Level Test is, and how it can improve final product quality and reduce time to market. Click here to download the white paper. » read more

Efficient Trace In RISC-V
By Ed Sperling - 19 Dec, 2022 - Comments: 0

Systems with RISC-V cores often include multiple types of other processors and accelerators. Peter Shields, product manager for Tessent at Siemens Digital Industries Software, talks about what's needed for debug and trace in context, including the need for unobtrusive observation at full speed, what to trace and when to trace it, and how embedded IP can identify to report which branches are tak... » read more

Silent Data Corruption
By Ed Sperling - 12 Dec, 2022 - Comments: 0

Defects can creep into chip manufacturing from anywhere, but the problem is getting worse at advanced nodes and in advanced packages where reduced pin access can make testing much more difficult. Ira Leventhal, vice president of U.S. Applied Research and Technology at Advantest America, talks about what’s causing these so-called silent data errors, how to find them, and why it now requires ma... » read more

Systematic Yield Issues Now Top Priority At Advanced Nodes
By Laura Peters - 06 Dec, 2022 - Comments: 0

Systematic yield issues are supplanting random defects as the dominant concern in semiconductor manufacturing at the most advanced process nodes, requiring more time, effort, and cost to achieve sufficient yield. Yield is the ultimate hush hush topic in semiconductor manufacturing, but it's also the most critical because it determines how many chips can be profitably sold. "At older nodes, b... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy