FinFET Rollout Slower Than Expected


The foundry business is heating up as some new and large players are entering the 16nm/14nm [getkc id="185" kc_name="finFET"] market. But foundry customers are taking longer than expected to migrate to finFETs amid some technical and cost issues. On the foundry front, [getentity id="22846" comment="Intel"] has been the sole player in finFETs for some time. But now, [getentity id="22865" ... » read more

Is Dark Silicon Wasted Silicon?


The concept of dark silicon sounds almost mysterious, but it is a simple matter of physics. With advances in technology nodes and the ability to pack more and more transistors on the same die, design engineers are reaching a wall where only a fraction of a design can be powered on due to power and thermal implications. Moreover, the challenges that force this kind of complex power managemen... » read more

Issues And Options At 5nm


While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

Rethinking The Cloud


Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

What Ford Is Driving


Jim Buczkowski, director of electrical and electronics systems research and advanced engineering at Ford Motor Co., sat down with Semiconductor Engineering to talk about quality, security, architectures, packaging and automotive's unique constraints. What follows are excerpts of that conversation. SE: As more electronic content is included in automobiles, what kinds of issues are you dealing... » read more

More Lithography Options?


Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

How To Deal With Electromigration


The replacement of aluminum with copper interconnect wiring, first demonstrated by IBM in 1997, brought the integrated circuit industry substantial improvements in both resistance to electromigration and line conductivity. Copper is both a better and more stable conductor than aluminum. Difficult though the transition was, it helped extend device scaling for another eighteen years (and counting... » read more

Still Waiting For III-V Chips


For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

Reliability Definition Is Changing


Since the invention of the integrated circuit, reliability has been defined by how long a chip continues to work. It either turned on and did what it was designed to do, or it didn't. But that definition is no longer so black-and-white. Parts of an SoC, or even an IP or memory block, can continue to function while other parts do not. Some may work intermittently, or at lower speeds. Others may ... » read more

IoT Will Force New Memory Paradigm


There are two things in life that have always been true: One is that you can never be too rich, and second—at least since the dawn of the technological age—you can never have too much memory. But the memory truism is changing with the onset of the [getkc id="76" comment="Internet of Things"]. The next generation of memory for the IoT must meet a different set of metrics – smaller, smar... » read more

← Older posts Newer posts →