category: System-Level Design

category: IoT, Security & Automotive

Navigating The Future Of EDA
By Anika Sunda - 27 Jun, 2024 - Comments: 0

The landscape of electronic design automation (EDA) is undergoing a monumental transformation. The catalysts? Artificial Intelligence (AI) and Machine Learning (ML). These technological marvels are not just reshaping how we approach design and verification in electronics; they are redefining the possibilities within the field. Our latest podcast episode delved deep into this topic, uncovering t... » read more

Digital Twins Gaining Traction In Complex Designs
By Ann Mutschler - 27 Jun, 2024 - Comments: 0

The integration of heterogeneous chiplets into an advanced package, coupled with the increasing digitalization of multiple industry segments, is pushing digital twins to the forefront of design. The challenge in these complex assemblies is figuring out the potential tradeoffs between different chiplets, different assembly approaches, and to be able to do it quickly enough to still hit market... » read more

The Fundamentals Of Software Testing
By Jonathon Wright - 27 Jun, 2024 - Comments: 0

Recently, I had a conversation with Paul Gerrard, the internationally renowned, award-winning software engineering consultant, author, and coach. We discussed the fact that testing is at the heart of software development. Obviously, as testers, we spend all day testing and thinking about testing. But developers test every line of code they write. Sometimes, users test. In fact, the all-perva... » read more

Streamlining SoC Design With Advanced IP And Integration Solutions
By Andy Nightingale - 27 Jun, 2024 - Comments: 0

As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The emphasis on physical awareness across solutions significantly reduces the iterative cycles of NoC placement and routing. By ensuring low latency and high efficiency, these advanced integration solution... » read more

Enabling 2.5D/3D Multi-Die Package
By Kenneth Larsen - 27 Jun, 2024 - Comments: 1

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets (also knowns as dies) into a single package, demands not only a new level of IC design innovation but also an increased complexity in coordination and integration. At the forefront of this technolo... » read more

Accelerate Test Regressions with Synopsys VIP Using Dynamic Test Loading in VCS
By Synopsys - 27 Jun, 2024 - Comments: 0

Functional verification ensures that a design meets its specification requirements. The initial 80% of the verification process significantly impacts the time needed to complete the final 20%, which involves extensive test scenarios and regression testing, often consuming substantial engineering resources. Typically, the desired scenario emerges late in the test case, often in the last minutes ... » read more

Data Coherence Across Silos And Hierarchy
By Brian Bailey - 27 Jun, 2024 - Comments: 0

Shift left has become a rallying cry for the chip design industry, but unless coherent data can flow between the groups being impacted, the value may not be as great as expected. Shift left is a term that encompasses attempts to bring analysis and decision-making forward in the development process. The earlier an issue can be found, the less of a problem it ultimately becomes. But in many ca... » read more

Use of NoC IP Facilitates Tailoring SoC Platform Design into Bespoke SoC Devices
By Arteris - 27 Jun, 2024 - Comments: 0

Customer Overview Dream Chip Technologies is a German company that originated from a research think tank initiative comprised of private companies and government-funded organizations in the beginning of 1990. The results from this effort were foundational in establishing German mastery of microelectronics. Dream Chip Technologies started as a design services provider, developing intellectua... » read more

Design Flow Challenged By 3D-IC Process, Thermal Variation
By Karen Heyman - 27 Jun, 2024 - Comments: 0

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the compute demands of AI and the continual shrinking of digital logic. 3D-ICs are widely viewed as the way to continue scaling beyond the limits of planar SoCs, and a way to add more heterogeneous d... » read more

Investing in EV Battery Testing — Benefits for EV Battery Designers
By Keysight - 27 Jun, 2024 - Comments: 0

Phasing out gas-powered internal combustion engines (ICE) and moving towards clean energy electric vehicles (EVs) brings substantial technology investments to deliver EVs to the mainstream market. Government legislation to eliminate or limit the production of ICEs by 2035 is creating a surge in demand for the EV ecosystem. This in turn, is driving demand for more efficient ways of EV battery sy... » read more

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