Verification In Crisis

By Ashish Darbari - 25 Apr, 2024 - Comments: 0

Why is it still so hard to ensure good quality sign-off happens without leaving behind bugs in silicon? The answer, according to my colleagues at DVCon, is highly nuanced. The industry has been improving overall, as has the complexity of designs. For ASICs, 74% of the designs surveyed in the recent Wilson Research Group/Siemens EDA report have one or more processor cores, 52% have two or mor... » read more

The Path Toward Future Automotive EE Architectures

By Frank Schirrmeister - 25 Apr, 2024 - Comments: 0

From a semiconductor market perspective, all eyes are on the automotive domain. According to Gartner, as of 2023, the automotive market is now its second-largest segment, with about 14% of the demand. Only smartphones consume more. As I mused last month in "Automotive Semiconductor March Madness 2024," those who made a bet on automotive a decade or longer ago are pretty happy these days. Still,... » read more

How To Get The Most Out Of Gate-All-Around Designs

By Andrew Appleby - 25 Apr, 2024 - Comments: 0

The semiconductor industry has relied on finFETs, three-dimensional field-effect transistors with thin vertical fins, for many generations of technology. However, the industry is reaching the limits of how much finFETs can be shrunk while maintaining their speed and power benefits, which are crucial for artificial intelligence (AI) and machine learning (ML) applications. The solution is the gat... » read more

Exploring The Security Framework Of RISC-V Architecture In Modern SoCs

By Anika Sunda - 25 Apr, 2024 - Comments: 0

In the rapidly evolving world of technology, system-on-chip (SoC) designs have become a cornerstone for various applications, from automotive and mobile devices to data centers. These complex systems integrate multiple processors, a multi-level cache hierarchy, and various subsystems that share memory and system resources. However, this open access to shared memory and resources introduces pote... » read more

How 6G Research Will Revolutionize Mobile Experiences

By Ben Coffin - 25 Apr, 2024 - Comments: 0

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented bandwidths, and ultra-low latencies. It will transform various sectors, including telecommunications, manufacturing, healthcare, transportation, and entertainment. In this article, get a glimpse of the 6G world coming to us over the next decade, and explore the 6G rese... » read more

Reduce 3D-IC Design Complexity: Early Package Assembly Verification

By Siemens EDA - 24 Apr, 2024 - Comments: 0

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process. What you'll learn: Overcom... » read more

Key Critical Specs You Should Know Before Selecting a Function Generator

By Keysight - 24 Apr, 2024 - Comments: 0

Selecting a benchtop function generator for your everyday use is very important. You want to be sure it produces the signal types that you need for your tests without introducing unwanted jitters, noise, harmonic distortions, or signal flaws. Introducing unwanted signal flaws inadvertently causes false test rejects due to your function generator. It is a common mistake to purchase the least exp... » read more

Bridging the Gap Between Industry and Academia

By Cadence - 24 Apr, 2024 - Comments: 0

The purpose of the Cadence Academic Network is to promote the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence in the areas of verification, design, and implementation of microelectronic systems. Taking a four-pronged approach of recruiting, promoting the Cadence university software program, establishing academic p... » read more

Blog Review: April 24

By Jesse Allen - 24 Apr, 2024 - Comments: 0

Cadence's Vatsal Patel notes the factors that make high-bandwidth memory ideal for AI, such as improved bandwidth and area from vertical stacking and power reduction features like data bus inversion. Synopsys' Rob van Blommestein points to early power network analysis as a way to ensure that enough power is delivered to each transistor to mitigate potential power-related issues within the ch... » read more

Rigorous Correlation Methodology for PCIe 5.0 & PCIe 6.0 DSP Based IBIS-AMI Models

By Alphawave Semi - 24 Apr, 2024 - Comments: 0

IBIS-AMI models have been around for a decade and evolved to provide off-chip and system designers an efficient way to assess link performance of high-speed electrical interfaces with transceivers implementing various combination of equalization techniques [1]. As with any model, for IBIS-AMI to be useful they need to be benchmarked and carefully correlated to real-world silicon performance of ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.