category: System-Level Design

category: IoT, Security & Automotive

SLM Evolves Into Critical Aspect Of Chip Design And Operation
By Ann Mutschler - 19 Dec, 2024 - Comments: 0

Silicon lifecycle management has evolved greatly in the past five years, moving from novel concept to a key part of design flows at industry leaders such as NVIDIA, Amazon Web Services, Ericsson, and others. Along with becoming a major focus for companies developing semiconductors, the use cases have expanded. While initially focused on post-silicon insights, SLM has expanded to cover the en... » read more

Achieving Successful Multi-Die Signoff
By Vamsi Thatha - 19 Dec, 2024 - Comments: 0

Multi-die designs leveraging 2.5D and 3D technologies are becoming crucial for various electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile devices. These designs allow the integration of dies from different foundries and technology nodes, enhancing density and interconnect speeds beyond traditional discrete dies. However, th... » read more

Blog Review: Dec. 18
By Jesse Allen - 18 Dec, 2024 - Comments: 0

Siemens’ Michael Munsey predicts that the convergence of AI, advanced packaging, and rise of software-defined products aren’t just incremental changes but will represent a fundamental shift in how we think about semiconductor design and manufacturing. Cadence's Veena Parthan points to hex-core voxels as a significant leap forward for the CFD meshing process that blends the best of struct... » read more

RISC-V Profiles Help Conformance
By Brian Bailey - 18 Dec, 2024 - Comments: 0

Experts At The Table: What's needed to be able to trust that a RISC-V implementation will work as expected across multiple designs using standard OSes. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeist... » read more

Distributed Voltage And Frequency Scaling Gaining Traction
By Ed Sperling - 16 Dec, 2024 - Comments: 0

DVFS has been used in smart phones for more than a decade as a way of trading off power and performance when both are constrained, but much of the semiconductor industry has avoided this technique because it's too difficult to work with. That's starting to change as processing demands increase, driven by the rollout of AI everywhere and an increase in the number of features in advanced packages... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2
By Archana Cheruliyil - 09 Dec, 2024 - Comments: 0

This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into HBM implementation challenges. Click here for part 1, for an overview on HBM, and in part 3, we will introduce details of a custom HBM implementation. Implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is a complex process that spans across architecture definition, designi... » read more

The Evolution of HBM
By Ed Sperling - 04 Dec, 2024 - Comments: 0

High-bandwidth memory originally was conceived as a way to increase capacity in memory attached to a 2.5D package. It has since become a staple for all high-performance computing, in some cases replacing SRAM for L3 cache. Archana Cheruliyil, senior product marketing manager at Alphawave Semi, talks about how and where HBM is used today, how it will be used in the future, why it is essential fo... » read more

Blog Review: Dec. 4
By Jesse Allen - 04 Dec, 2024 - Comments: 0

Siemens' Reetika explains how creating and verifying a complete reset tree structure allows designers to trace the flow of reset signals across the design and ensure that every sequential element is tagged correctly within its respective reset domain. Cadence's Durlov Khan suggests DDR5 DIMM Memory Models and Discrete Component Models as part of a flexible approach to validating specific com... » read more

Chip Companies Play Bigger Role In Shaping University Curricula
By Liz Allan - 02 Dec, 2024 - Comments: 0

A shortage of senior engineers with the necessary skills and experience is forcing companies to hire and train fresh graduates, a more time-consuming process but one that allows them to rise through the ranks using the companies' preferred technology and systems. Universities and companies share the goal of helping a graduate become productive in the workplace as quickly as possible, and the... » read more

Goal-Driven AI
By Brian Bailey - 26 Nov, 2024 - Comments: 2

For many, the long-term dream for AI within EDA is the ability to define a set of goals and tell the computer to go design it for them. A short while later, an optimized design will pop out. All of today's EDA tools will remain hidden, if they even exist at all. You would only be limited by your imagination. But we also know that AI is not to be trusted today, especially when millions of dol... » read more

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