category: System-Level Design

category: IoT, Security & Automotive

Blog Review: June 25
By Jesse Allen - 25 Jun, 2025 - Comments: 0

Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved. Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation... » read more

Design and Test Solutions for E-Mobility and Autonomous Driving
By Keysight - 25 Jun, 2025 - Comments: 0

The automotive industry is accelerating its electronic technology revolution and fusing with the clean energy ecosystem. By 2030, 4.2 million cars will be autonomous and 50% will be electric. Dramatic increases in the number of sensors and applications in new automobiles have evolved the vehicle from a peripheral role to a network hosting clusters of connected devices. Cars now need to be o... » read more

EDA’s Top Execs Map Out An AI-Driven Future
By Ed Sperling - 23 Jun, 2025 - Comments: 0

Artificial intelligence is permeating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to create them, and the methodologies used to ensure they will work reliably. This is a global race that will redefine nearly every domain over the next decade. In presentations and interviews over the past several months, top EDA executives converged on th... » read more

Can You Build A Known-Good Multi-Die System?
By Ed Sperling - 18 Jun, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Blog Review: June 18
By Jesse Allen - 18 Jun, 2025 - Comments: 0

Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

Agentic AI In Chip Design
By Ann Mutschler - 11 Jun, 2025 - Comments: 1

Large language models (LLMs) like ChatGPT are just the starting point for generating content with AI. The next phase will be about harnessing LLMs with agents, providing automated feedback and improvements in performance and accuracy. Mehir Arora, backend engineer at ChipAgents, talks about the impact this can have on EDA and chip design, allowing smaller teams to compete with larger teams, and... » read more

Blog Review: June 4
By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

Mastering Chiplet Design
By Michelle Clancy Fuller - 03 Jun, 2025 - Comments: 0

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures. This modular approach promises enhanced performance, cost efficiency, and scalability, but it also brings unique system-level verification challenges that design teams must overcome. Chiplet systems break different functions into smaller, separate dies, improving yield an... » read more

Accelerating Scalable Computing
By Shivi Arora - 02 Jun, 2025 - Comments: 0

By Shivi Arora and Sue Hung Fung As computing demands for HPC, AI/ML, and cloud infrastructure grow, modular architectures are replacing traditional monolithic System-on-Chip (SoC) designs. These legacy designs are increasingly expensive and difficult to scale due to ever-increasing silicon complexity. In response, the industry is embracing chiplet-based System-in-Package (SiP) solutions,... » read more

The DAC Valuation
By Brian Bailey - 29 May, 2025 - Comments: 2

The Design Automation Conference is approaching fast, and the evidence of a funding gap is in plain sight. An entire day of the technical conference has been dropped. This is disheartening to say the least, and in the long term it may be a very costly mistake. The problems started when the Internet bubble burst in 2000. Until then, DAC was growing to the point whereby few convention halls we... » read more

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