Revolutionizing High-Performance Silicon With Next-Gen Chiplets

By Shivi Arora - 31 Oct, 2024 - Comments: 0

By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

HW and SW Architecture Approaches For Running AI Models

By Karen Heyman - 31 Oct, 2024 - Comments: 0

How best to run AI inference models is a current topic of much debate as a wide breadth of systems companies look to add AI to a variety of systems, spurring both hardware innovation and the need to revamp models. Hardware developers are making progress with AI accelerators and SoCs. But on the model side, questions abound about whether the answer might come from revisiting older, less compl... » read more

Locking When Emulating Xtensa LX Multi-Core On A Xilinx FPGA

By Nayan Gaywala - 31 Oct, 2024 - Comments: 0

Today's high-performance computing systems often require the designer to instantiate multiple CPU or DSP cores in their subsystem. However, the performance gained by using multiple CPUs comes with additional programming complexity, especially when accessing shared memory data structures and hardware peripherals. CPU cores need to access shared data in an atomic fashion in a multi-core environme... » read more

RISC-V Conformance

By Brian Bailey - 31 Oct, 2024 - Comments: 0

Experts At The Table: Despite growing excitement and participation in the development of the RISC-V ecosystem, significant holes remain in the development flow. One of the most concerning is conformance, which must exist before software portability becomes possible. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO... » read more

Mastering Cyber Awareness: Training For The Digital Battlefield

By Allison Freedman - 31 Oct, 2024 - Comments: 0

In today’s digital battlefield, cyber awareness is crucial for warfighters. To effectively prepare them, it’s essential to create realistic and detailed models of mobile networks, encompassing both physical and virtual infrastructure. This is where network modeling software comes into play, offering a high-fidelity approach to enhance cyber situational awareness. A high-fidelity modeling an... » read more

Accelerate AI SoC Designs with NoC Tiling

By Arteris - 30 Oct, 2024 - Comments: 0

Network-on-chip (NoC) tiling technology is revolutionizing AI and machine learning-enabled semiconductor designs. This emerging approach uses proven, robust network-on-chipIP to facilitate scaling, condense design time, speed testing and reduce design risk. It allowsSoC architects to create modular, scalable designs by replicating soft tiles across the chip. Each soft tile represents a self-con... » read more

Blog Review: Oct. 30

By Jesse Allen - 30 Oct, 2024 - Comments: 0

Synopsys' Frank Schirrmeister argues that hardware-assisted verification techniques like emulation and prototyping are essential to help engineers improve design behavior to manage complexity and ensure systems function seamlessly in real-world applications. Siemens’ Stephen V. Chavez finds that ultra high-density interconnect (UHDI) has changed the design and production of PCBs to enable ... » read more

Early Architecture Performance and Power Analysis of Multi-Die Designs

By Synopsys - 30 Oct, 2024 - Comments: 0

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including: -System pathfinding -Memory utilization and coherency -Power/thermal management Find out how to overcome such chall... » read more

Four Real-World Applications for Electromagnetic Simulation

By Keysight - 30 Oct, 2024 - Comments: 0

With the complexity of integrated circuit (IC) components increasing, electromagnetic (EM) circuit simulation is now critical for accurate and efficient design. The EM effects on a circuit can drastically alter voltage levels and damage semiconductor devices. With EM simulation, designers can account for EM effects on their circuit to avoid costly problems before they happen. EM simulation e... » read more

Blog Review: Oct. 23

By Jesse Allen - 23 Oct, 2024 - Comments: 0

Cadence’s Sanjeet Kumar introduces the message bus interface in the PHY Interface for the PCIe, SATA, USB, DisplayPort, and USB4 Architectures (PIPE) specification, which provides a way to initiate and participate in non-latency-sensitive PIPE operations using a small number of wires. Siemens’ Dennis Brophy argues that the recently published Portable Test and Stimulus Standard (PSS) 3.0 ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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