category: System-Level Design

category: IoT, Security & Automotive

NOP Flit Payload: A Dedicated Debug Channel
By Geeta Arora - 24 Apr, 2025 - Comments: 0

Modern PCIe systems are complex, with high-speed data transfer and intricate protocols. Traditional debug methods often struggle to provide the necessary granularity and real-time visibility into link behavior. Transient issues, timing-sensitive errors, and protocol interactions can be difficult to pinpoint with conventional methodology. NOP Flit addresses this challenge. PCIe Gen 6 introduc... » read more

Analog Creates Ripples in Digital Verification
By Brian Bailey - 24 Apr, 2025 - Comments: 0

We live in an analog world, but analog has been minimized whenever possible. At some point digital and analog must come together in every electronic device, and that has long been an area where errors creep in. The Wilson Research Group and Siemens EDA functional verification study has long shown that analog and mixed signal are two of the highest causes of flaws that result in chip respins.... » read more

What Is Electronic Design Automation And Why Do You Need It?
By Roberto Piacentini Filho - 24 Apr, 2025 - Comments: 0

As data speeds push into the multi-gigabit range and requirements on digital systems grow more complex, cutting down the time-to-market while also ensuring error-free reliable designs seems impossible. Traditional design tools and practices can result in failed prototypes, costly respins, delayed time-to-market, missed market opportunities, and subpar performance. This is why advanced EDA to... » read more

Multi-Die Design Start Guide
By Synopsys - 23 Apr, 2025 - Comments: 0

If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, performance, and area (PPA), functional scalability, and time-to-market advantages of multi-die designs using 2.5D and 3D technologies. The advantages are the main reason the adoption of multi-die des... » read more

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design
By Cadence - 23 Apr, 2025 - Comments: 0

In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

Combination of Coherent and Non-Coherent NoCs Facilitates Cutting-Edge SoC Design
By Arteris - 23 Apr, 2025 - Comments: 0

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Business Challenge • Develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Design Challenges • Ensure different portions ... » read more

Modeling Flux-Quantizing Josephson Junction Circuits
By Keysight - 23 Apr, 2025 - Comments: 0

We introduce Josephson junction and inductor models in Keysight ADS that feature an auxiliary flux port, and facilitate the expression of flux quantization conditions in simulation of superconducting microwave circuits. We present several examples that illustrate our methodology for constructing flux-quantizing circuits, including dc- and rf-SQUIDs, tunable couplers, and parametric amplifiers u... » read more

What’s Changing In SerDes
By Ed Sperling - 16 Apr, 2025 - Comments: 0

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product marketing manager at Alphawave Semi, talks about the impact of faster data movement on the transmitter (more power) and on the receiver (gain and advanced equalization), how to ensure signal inte... » read more

Blog Review: Apr. 16
By Jesse Allen - 16 Apr, 2025 - Comments: 0

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB. Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI... » read more

AI Agents Need Goals
By Brian Bailey - 16 Apr, 2025 - Comments: 0

Experts At The Table: Definitions and goals matter when it comes to using AI effectively, and it has to be tightly reined in to be effective. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, including Johannes Stahl, senior director of product line management for the Systems Design Group at Synopsys; Michael Young, director of product marketing for ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy