Leaps in Quantum Computing


There are new computers that are generating some amazing results for solving problems in record time.  You won’t see these computers on the classic Top500 lists though, because they aren’t approaching computing in the same way. Using quantum computing algorithms like Shor’s algorithm for factoring large numbers, quantum computing holds the promise of solving problems that take exponentia... » read more

Causes Of Memory Unsafety


Memory unsafety is a characteristic of many of today’s systems. The root cause of buffer bounds vulnerabilities such as buffer overflows and over-reads is unsafe programming. Major software vendors consistently report memory unsafety problems. For example, the Chromium open-source browser project has stated that 69% of CVEs (Common Vulnerabilities and Exposures) reported relate to memory... » read more

Making Connections In 3D Heterogeneous Integration


Activity around 3D heterogeneous integration (3DHI) is heating up, driven by growing support from governments, the need to add more features and compute elements into systems, and a widespread recognition that there are better paths forward than packing everything into a single SoC at the same process node. The leading edge of chip design has changed dramatically over the last few years. Int... » read more

AI For Circuit Design Quality, Productivity, And Advanced-Node Mapping


The future of circuit design, encompassing analog, RF/5G, and custom electronic circuits, is set to be revolutionized by the integration of generative AI tools. These advanced tools will not only enhance the quality of designs and boost designer productivity but also facilitate the mapping of designs from older semiconductor process nodes to more advanced nodes such as 3nm and below. This blog ... » read more

Let’s Do The (IC Design) Time Warp Again


For the most part, we’ve all been doing integrated circuit (IC) and system-on-chip (SoC) layout the same way for decades. Designers put together the design, be it intellectual property (IP), block, or full chip, then begin running physical verification. For design rule checking (DRC), this process consists of running all appropriate rule checks for the component on all available layouts. The ... » read more

Powering Up Electric Heavy-Duty Vehicles


Smokey tailpipe emissions may soon be a thing of the past, as the heavy transport vehicle market catches up with the electric car market to lower their contribution to greenhouse gas (GHG) emissions. Private sedans and light-duty trucks lead the vehicle electrification race, leaving much upside opportunity for heavy transport fleets such as trucks and buses to catch up. In the United Stat... » read more

Navigating EDA Vendor Cloud Options


Experts at the Table: Semiconductor Engineering sat down to discuss the challenges of cost-dependent cloud decisions, and how to navigate between different EDA vendor clouds options with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Systems; Richard Ho, vice president hardware engineering ... » read more

Selective Radiation Mitigation For Integrated Circuits


Shortened lifecycles and cost reduction coupled with the demand for advanced capabilities continue to challenge project teams delivering IC into space systems. To meet these demands, project teams must continue to evolve across all aspects of the lifecycle, including the implementation and verification of mitigation protections against single event effects. This paper defines a methodology t... » read more

FIR And Median Filter Accelerators In CodAL


5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G) which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable mul... » read more

ESD Co-Design For 224G And 112G SerDes In FinFET Technologies


In addressing the challenges of enhancing ESD resilience for high-speed SerDes interfaces, it's crucial to ensure the implementation of appropriate ESD protection measures. This is particularly vital during the device's lifecycle from the conclusion of silicon wafer processing to system assembly, a phase during which electronic devices are highly susceptible to Electrostatic Discharge (ESD) dam... » read more

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