category: System-Level Design

category: IoT, Security & Automotive

Comparing And Spotting The Difference Between Two Simulations
By Vtool - 26 Jan, 2022 - Comments: 0

Comparing is a basic skill we all use in our daily lives in order to understand reality and analyze situations. When it comes to chip verification, the fundamental task of checking also involves comparing because checking is always "checking vs. something" — the ASIC specification and/or a model. In practice, when we encounter a failing test, oftentimes we have a comparable passing tes... » read more

Leveraging Multi-Protocol PHY For PCIe To Cope With SoC Design Complexity
By Cadence - 26 Jan, 2022 - Comments: 0

Now in the post-Moore’s Law era, the fast-evolving semiconductor market is continually geared toward higher performance and feature-rich integrated chip (IC) solutions. More functional design blocks integrated with growing interconnections—to not only increase the overall throughput but also expand the I/O connectivity—resulted in a more powerful system on chip (SoC). This increasing comp... » read more

6G: Going Beyond 100 Gbps To 1 Tbps
By Keysight - 26 Jan, 2022 - Comments: 0

6G research is in its very early stages. The vision for what the International Telecommunication Union calls Network 2030 continues to take shape. While the industry is years away from starting the standards development process, subterahertz (sub-THz) territory is a focus of active research. Getting to 100 gigabits per second (Gbps) to 1 terabit per second (Tbps) data throughput is a key obj... » read more

Blog Review: Jan. 26
By Jesse Allen - 26 Jan, 2022 - Comments: 0

Arm's Mark Inskip shares how the Morello prototype architecture, aimed at improving the security of hardware, was developed, from the creation of the prototype architecture specification, followed by the design and implementation of a new CPU, through to the development of a new SoC, hardware platform, development tools, toolchains, and software. Cadence's Paul McLellan looks at how the RISC... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jan, 2022 - Comments: 0

Tools & design EDA industry revenue increased 7.1% year-over-year from $2.95 billion to $3.46 billion in Q3 2021, according to the ESD Alliance. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth," said Walden C. Rhines, Executive Sponsor of the SEMI Electron... » read more

Blog Review: Jan. 19
By Jesse Allen - 19 Jan, 2022 - Comments: 0

Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Jan, 2022 - Comments: 0

Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Setting Ground Rules For 3D-IC Designs
By Ed Sperling - 12 Jan, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Blog Review: Jan. 12
By Jesse Allen - 12 Jan, 2022 - Comments: 0

Synopsys' Twan Korthorst introduces the history of photonics, why it is important for the semiconductor industry, key market applications, and the future of photonic integrated circuits. Cadence's Paul McLellan takes a look at TSMC's recent announcements around its N3 and N3 HPC notes and the push for performance gains through design technology co-optimization Siemens' Sebastian Flock che... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Jan, 2022 - Comments: 0

SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

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