category: Manufacturing

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Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization
By Brewer Science - 20 May, 2021 - Comments: 0

In EUV lithography, spin-on silicon hardmasks have been widely used not only as etch transfer layers, but also as assist layers to enhance the lithographic performance of resist. In this study, we demonstrate a novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach. By varying the concentration and type of the functional g... » read more

Ferroelectric, hafnium oxide based transistors for digital beyond von-Neumann computing
By Technical Paper Link - 21 Apr, 2021 - Comments: 0

Source: AIP Applied Physics Letters, published 2/4/2021.  Evelyn T. Breyer1,  Halid Mulaosmanovic1,  Thomas Mikolajick1,2, and  Stefan Slesazeck1 1Nanoelectronic Materials Laboratory (NaMLab) gGmbH, 01187 Dresden, Germany 2Chair of Nanoelectronics, TU Dresden, 01187 Dresden, Germany   Technical paper link is here » read more

Defect Mitigation And Characterization In Silicon Hardmask Materials
By Brewer Science - 17 Mar, 2021 - Comments: 0

From SPIE Digital Library: In this study, metal contaminants, liquid particle count and on-wafer defects of Si- HMs and filtration removal rates are monitored to determine the effect of filter type, pore size, media morphology, and cleanliness on filtration performance. 5-nm PTFE NTD2 filter having proprietary surface treatment used in this study shows lowest defect count. Authors: Vineet... » read more

The Decadal Plan for Semiconductors
By Technical Paper Link - 08 Feb, 2021 - Comments: 0

Semiconductor Research Corporation and Semiconductor Industry Association released the full Decadal Plan for Semiconductors: a roadmap, for 2030 and beyond. It’s a report that outlines chip research and funding priorities for the next decade. Find the Report Overview, Abridged Report and the Full Report here. » read more

Pressure-induced Anderson-Mott transition in elemental tellurium
By Technical Paper Link - 07 Jan, 2021 - Comments: 0

Oliveira, J.F., Fontes, M.B., Moutinho, M. et al. Pressure-induced Anderson-Mott transition in elemental tellurium. Commun Mater 2, 1 (2021). https://doi.org/10.1038/s43246-020-00110-1 Abstract: "Elemental tellurium is a small band-gap semiconductor, which is always p-doped due to the natural occurrence of vacancies. Its chiral non-centrosymmetric structure, characterized by helical chains ... » read more

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration
By Brewer Science - 18 Nov, 2020 - Comments: 0

Authors: Aiwen Wu (Entegris, Inc. — United States), Hareen Bayana (Entegris GmbH — Germany), Philippe Foubert (imec — Belgium), Andrea Chacko and Douglas Guererro (Brewer Science, Inc. — United States). This paper describes efforts to leverage different filtration parameters, including retention ratings and membrane materials, to understand their impact on EUV underlayer coating defe... » read more

Graphene and two-dimensional materials for silicon technology
By Technical Paper Link - 02 Oct, 2020 - Comments: 1

Abstract: "The development of silicon semiconductor technology has produced breakthroughs in electronics—from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones—by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device ... » read more

Development Of Planarizing Spin-On Carbon Materials For High-Temperature Processes
By Brewer Science - 20 Aug, 2020 - Comments: 0

Multilayer lithography is used for advanced semiconductor processes to pattern complex structures. As more and more procedures incorporate a high-temperature process, such as chemical vapor deposition (CVD), the need for thermally stable materials increases. For certain applications, a spin-on carbon (SOC) layer under the CVD layer is required to survive through a high-temperature process. ... » read more

Super Planarizing Material For Trench And Via Arrays
By Brewer Science - 21 May, 2020 - Comments: 0

As device design scales and becomes more complex, fine control of patterning and transfer steps is integral. Planarization of deep trenches and via arrays has always been a challenge. Aspect ratios continue to increase while critical dimensions shrink, and typical trench fill schemes are no longer able to meet the fill and planarization requirements. Traditional design of spin-on carbon (SOC) m... » read more

Thin Film Characterization For Advanced Patterning
By Brewer Science - 18 Mar, 2020 - Comments: 0

Authors: Zhimin Zhu; Xianggui Ye; Sean Simmons; Catherine Frank; Tim Limmer; James Lamb Brewer Science, Inc. (United States) A variable-angle spectroscopic ellipsometer (VASE) is an essential tool for measuring the thickness of a thin film, as well as its n and k optical parameters. However, for films thinner than 10 nm, precise measurement is very challenging. In this paper, the root cause... » read more

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