category: Top Stories

category: IoT, Security & Automotive

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

3D Integration Supports CIM Versatility And Accuracy
By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Fabs Begin Ramping Up Machine Learning
By Anne Meixner - 19 Dec, 2023 - Comments: 0

Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases. Building robust models requires training the algorithms... » read more

Proprietary Vs. Commercial Chiplets
By Ed Sperling - 19 Dec, 2023 - Comments: 0

Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in... » read more

Modeling Compute In Memory With Biological Efficiency
By Katherine Derbyshire - 19 Dec, 2023 - Comments: 0

The growing popularity of generative AI, which uses natural language to help users make sense of unstructured data, is forcing sweeping changes in how compute resources are designed and deployed. In a panel discussion on artificial intelligence at last week’s IEEE Electron Device Meeting, IBM’s Nicole Saulnier described it as a major breakthrough that should allow AI tools to assist huma... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Big Shifts In Power Electronics Packaging
By Laura Peters - 16 Nov, 2023 - Comments: 0

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the packaging needed to protect and connect these devices. Packaging is playing an increasingly critical role in the transition to higher power densities, enabling more efficient power supplies, power deli... » read more

IC Manufacturing Targets Less Water, Less Waste
By Anne Meixner - 16 Nov, 2023 - Comments: 0

Fabs, OSATs, and equipment makers are accelerating their efforts to consume less water while recycling more material waste in a trend toward better sustainability. With chips, sustainability is heavily focused on carbon emissions, and energy consumption is a significant contributor. But there is an equal effort underway to reduce water consumption and pollution. Across the globe, the number ... » read more

Increasing AI Energy Efficiency With Compute In Memory
By Katherine Derbyshire - 16 Nov, 2023 - Comments: 0

Skyrocketing AI compute workloads and fixed power budgets are forcing chip and system architects to take a much harder look at compute in memory (CIM), which until recently was considered little more than a science project. CIM solves two problems. First, it takes more energy to move data back and forth between memory and processor than to actually process it. And second, there is so much da... » read more

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