category: Top Stories

category: IoT, Security & Automotive

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

How To Test Autonomous Vehicles
By Kevin Fogarty - 12 Jul, 2018 - Comments: 1

By Kevin Fogarty and Ed Sperling The race is on to develop ways of testing autonomous vehicles to prove they are safe under most road conditions, but this has turned out to be much more difficult than initially thought. The autonomous vehicle technology itself is still in various stages of development, with carmakers struggling to fine-tune AI algorithms that can guide robots on wheels th... » read more

Preparing For A 5G World
By Ed Sperling - 12 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

The Growing Materials Challenge
By Katherine Derbyshire - 11 Jun, 2018 - Comments: 0

By Katherine Derbyshire & Ed Sperling Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems. Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips contin... » read more

Extending The IC Roadmap
By Mark LaPedus - 11 Jun, 2018 - Comments: 0

An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on next-generation transistors, but it is also developing several new technologies for IC packaging, such as a proprietary silicon bridge, a cooling technology and packaging modules. What follows are excerpts of t... » read more

Hardware-In-The-Loop Simulation, Testing
By Jeff Dorsch - 11 Jun, 2018 - Comments: 0

Embedded electronics are showing up nearly everywhere these days, in cars, smart appliances, medical devices—even fighter jets. Making sure those real-time embedded systems will work correctly is the aim of hardware-in-the-loop simulation and testing, which puts the systems through their paces in a virtual environment. In effect, HIL simulation adds a mathematical representation of all fun... » read more

Integrating Memristors For Neuromorphic Computing
By Katherine Derbyshire - 16 May, 2018 - Comments: 1

Much of the current research on neuromorphic computing focuses on the use of non-volatile memory arrays as a compute-in-memory component for artificial neural networks (ANNs). By using Ohm’s Law to apply stored weights to incoming signals, and Kirchoff’s Laws to sum up the results, memristor arrays can accelerate the many multiply-accumulate steps in ANN algorithms. ANNs are being dep... » read more

OSAT Consolidation Continues
By Jeff Dorsch - 14 May, 2018 - Comments: 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

Software-Defined Test And Measurement
By Jeff Dorsch - 07 May, 2018 - Comments: 0

Software-defined radios, instrumentation and test are ramping up alongside a flood of new technologies related to assisted and autonomous vehicles, 5G, and military/aerospace electronics, breathing new life and significant change into the test and measurement market. Software-defined test adds flexibility in markets where the products and protocols are evolving or still being defined, and wh... » read more

Packaging Chips For Cars
By Jeff Dorsch - 07 May, 2018 - Comments: 2

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle. This is true for all safety-critical applications, but for automotive in particular there are several key reasons w... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy