category: Top Stories

category: IoT, Security & Automotive

Smaller Nodes, Much Bigger Problems
By Ed Sperling - 15 Jul, 2020 - Comments: 3

João Geada, chief technologist at Ansys, sat down with Semiconductor Engineering to talk about device scaling, advanced packaging, increasing complexity and the growing role of AI. What follows are excerpts of that conversation. SE: We've been pushing along Moore's Law for roughly a half-century. What sorts of problems are you seeing now that you didn't see a couple nodes ago? Geada: The... » read more

Why Safety-Critical Verification Is So Difficult
By Ann Mutschler - 15 Jul, 2020 - Comments: 0

The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Maximizing Value Post-Moore’s Law
By Brian Bailey - 13 Jul, 2020 - Comments: 0

When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

Moving Data And Computing Closer Together
By Bryon Moyer - 09 Jul, 2020 - Comments: 2

The speed of processors has increased to the point where they often are no longer the performance bottleneck for many systems. It's now about data access. Moving data around costs both time and power, and developers are looking for ways to reduce the distances that data has to move. That means bringing data and memory nearer to each other. “Hard drives didn't have enough data flow to cr... » read more

Designing For Extreme Low Power
By Brian Bailey - 09 Jul, 2020 - Comments: 3

There are several techniques available for low power design, but whenever a nanowatt or picojoule matters, all available methods must be used. Some of the necessary techniques are different from those used for high-end designs. Others have been lost over time because their impact was considered too small, or not worth the additional design effort. But for devices that last a lifetime on a si... » read more

Power Impact At The Physical Layer Causes Downstream Effects
By Ann Mutschler - 09 Jul, 2020 - Comments: 0

Data movement is rapidly emerging as one of the top design challenges, and it is being complicated by new chip architectures and physical effects caused by increasing density at advanced nodes and in multi-chip systems. Until the introduction of the latest revs of high-bandwidth memory, as well as GDDR6, memory was considered the next big bottleneck. But other compute bottlenecks have been e... » read more

Startup Funding: June 2020
By Jesse Allen - 08 Jul, 2020 - Comments: 0

Two Chinese startups drew big investment as the country aims to become more semiconductor independent as trade restrictions continue. One company deals in wafers, packaging, and IC design, while the other is focused on AI chips. Quantum computing startups didn't see large investments this month, as most are still very young companies, but the number of them grew with a new university spin-out e... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Monitoring IC Abnormalities Before Failures
By Anne Meixner - 07 Jul, 2020 - Comments: 0

The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

Data Becomes Key For Next-Gen Chips
By SE Staff - 07 Jul, 2020 - Comments: 1

Data has become vital to understanding the useful life of a semiconductor — and the knowledge gleaned is key to staying competitive beyond Moore’s Law. What's changed is a growing reliance earlier in the design cycle on multiple sources of data, including some from further right in the design-through-manufacturing flow. While this holistic approach may seem logical enough, the semiconduc... » read more

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