More Processing Everywhere


Simon Segars, CEO of Arm Holdings, sat down with Semiconductor Engineering to discuss security, power, the IoT, a big push at the edge, and the rise of 5G and China. What follows are excerpts of that conversation. SE: Are we making any progress in security? And even if Arm makes progress, does it matter, given there are so many things connected together? Segars: It feels like we’re maki... » read more

Process Variation Not A Solved Issue


Semiconductor Engineering sat down to talk about process variation in advanced nodes, and how design teams are coping, with Christoph Sohrmann, a member of the Advanced Physical Verification group in Fraunhofer’s Division of Engineering of Adaptive Systems (EAS); Juan Rey, vice president of engineering at Mentor, A Siemens Business; and Stephen Crosher, CEO of Moortec Semiconductor. What foll... » read more

$8.5B For Auto, IoT, Security Startups


Investors infused $4.9 billion into automotive-related startups, nearly $2.5 billion into IoT startups and almost $1.2 billion into cybersecurity startups so far in 2018, according to Semiconductor Engineering’s estimates of private funding in the first six months of 2018. Popular investments included companies using artificial intelligence, big data analytics, blockchain, machine learning... » read more

Agile Standards


Semiconductor Engineering sat down with Lu Dai, chairman for Accellera and senior director of engineering at Qualcomm, to discuss what's changing in standards development. What follows are excerpts of that conversation. SE: Accellera has had a great first half of the year. Dai: Yes, we are only half way through the year and yet we got Portable Stimulus Standard (PSS) out, the SystemC CCI ... » read more

The Chiplet Race Begins


Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Return Of The Organic Interposer


Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Auto Chip Test Getting Harder


Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range of technical and even cultural barriers. Advanced driver assist systems (ADAS) already are the most complex systems by far in modern cars, the best of which hover between Level 2 and Level 3 on the five-step autonomy ladder maintained by the Society of Automotiv... » read more

More Sigmas In Auto Chips


The journey to autonomous cars is forcing fundamental changes in the way chips are designed, tested and tracked, from the overall system functionality to the IP that goes into those systems. This includes everything from new requirements for automotive-grade chips to longer mean time between failures. But it also makes it far more challenging, time-consuming and complicated to create these d... » read more

Why The IIoT Is Not Secure


The Internet of Things is famously insecure, but not because the technology to build it or secure it is immature. Likewise, severely insufficient security on the Industrial IoT suffers from a lack of will. Neither tech buyers nor providers have yet invested the same effort expended in other areas of the tech world to create and adopt steps that will make everyone safer, according to chipmakers ... » read more

Hardware Security Threat Rising


Martin Scott, senior vice president and CTO of Rambus, sat down with Semiconductor Engineering to talk about an increasing problem with security, what's driving it, and why hardware is now part of the growing attack surface. What follows are excerpts of that conversation. SE: With Meltdown and Spectre, the stakes have changed because the focus is not on using hardware to get to software. It'... » read more

← Older posts Newer posts →