category: Top Stories

category: IoT, Security & Automotive

More Lithography/Mask Challenges (Part 3)
By Mark LaPedus - 16 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Regina Freed, managing director of patterning technology at [getentity id="... » read more

OSAT Consolidation Continues
By Jeff Dorsch - 14 May, 2018 - Comments: 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

Power Optimization Strategies Widen
By Brian Bailey - 10 May, 2018 - Comments: 0

An increasing amount of electronic content in new and existing markets is creating different and sometimes competing demands for power optimization. For the past decade, EDA has been driven by the mobile phone industry, where the emphasis is on better power analysis and optimization tools to reduce power consumption and extend battery life. While energy efficiency continues to improve, other... » read more

System-Level Power Modeling Takes Root
By Ann Mutschler - 10 May, 2018 - Comments: 0

Power, heat, and their combined effects on aging and reliability, are becoming increasingly critical variables in the design of chips that will be used across a variety of new and existing markets. As more processing moves to edge, where sensors are generating a tsunami of data, there are a number of factors that need to be considered in designs. On one side, power budgets need to reflect th... » read more

Does Power Verification Work?
By Brian Bailey - 10 May, 2018 - Comments: 1

Functional verification continues to evolve, but power verification—a somewhat new concern—remains at levels of sophistication reminiscent of functional verification 30 years ago. When will power verification catch up and what must to happen to make it possible? These are questions that the industry is still grappling with, and not everyone believes they require answers. Functional error... » read more

Designing Hardware For Security
By Ed Sperling - 09 May, 2018 - Comments: 1

By Ed Sperling and Kevin Fogarty Cyber criminals are beginning to target weaknesses in hardware to take control of devices, rather than using the hardware as a stepping stone to access to the software. This shift underscores a significant increase in the sophistication of the attackers, as evidenced by the discovery of Spectre and Meltdown by Google Project Zero in 2017 (made public in Ja... » read more

MIS Packaging Takes Off
By Mark LaPedus - 07 May, 2018 - Comments: 0

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

Software-Defined Test And Measurement
By Jeff Dorsch - 07 May, 2018 - Comments: 0

Software-defined radios, instrumentation and test are ramping up alongside a flood of new technologies related to assisted and autonomous vehicles, 5G, and military/aerospace electronics, breathing new life and significant change into the test and measurement market. Software-defined test adds flexibility in markets where the products and protocols are evolving or still being defined, and wh... » read more

Packaging Chips For Cars
By Jeff Dorsch - 07 May, 2018 - Comments: 2

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle. This is true for all safety-critical applications, but for automotive in particular there are several key reasons w... » read more

Challenges At The Edge
By Kevin Fogarty - 03 May, 2018 - Comments: 0

By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

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