category: Top Stories

category: Auto, Security & Edge AI

Less Margin, More Respins, And New Markets
By Ed Sperling - 10 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Reducing Costly Flaws In Heterogeneous Designs
By Ed Sperling - 08 Oct, 2019 - Comments: 0

The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

Shrinking AV’s 1 Billion Test Miles
By Kevin Fogarty - 08 Oct, 2019 - Comments: 0

There is still no answer to how many miles an autonomous vehicle needs to drive before it's proven safe. But some AV developers and test companies are hoping to ease the burden a bit with automation that makes millions of real and simulated miles of road testing simpler to implement, supported by standards that make it easier to create and trade simulation scenarios. The goal is to reduce th... » read more

Testing Against Changing Standards In Automotive
By Ed Sperling and Kevin Fogarty - 08 Oct, 2019 - Comments: 0

The infusion of more semiconductor content into cars is raising the bar on reliability and changing the way chips are designed, verified and tested, but it also is raising a lot of questions about whether companies are on the right track at any point in time. Concerns about liability are rampant with autonomous and assisted driving, so standards are being rolled out well in advance of the te... » read more

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Solving The Memory Bottleneck
By Brian Bailey - 04 Oct, 2019 - Comments: 4

Chipmakers are scrambling to solve the bottleneck between processor and memory, and they are turning out new designs based on different architectures at a rate no one would have anticipated even several months ago. At issue is how to boost performance in systems, particularly those at the edge, where huge amounts of data need to be processed locally or regionally. The traditional approach ha... » read more

Why EV Battery Design Is So Difficult
By Ann Mutschler - 03 Oct, 2019 - Comments: 4

Automotive batteries always have been treated as plug-and-play parts of a vehicle, but that approach no longer works in electric vehicles. In fact, the battery is now a differentiating factor, and it is the heaviest and most expensive component. What used to be a relatively simple component has been replaced by a variety of sensors to measure complex static thermal and aging effects, as well... » read more

New Security Risks Create Need For Stealthy Chips
By Ed Sperling - 03 Oct, 2019 - Comments: 0

Semiconductors are becoming more vulnerable to attacks at each new process node due to thinner materials used to make these devices, as well as advances in equipment used to simulate how those chips behave. Thinner chips are now emitting light, electromagnetic radiation and various other types of noise, which can be observed using infrared and acoustic sensors. In addition, more powerful too... » read more

ML, Edge Drive IP To Outperform Broader Chip Market
By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

Over $7 Billion Raised In Mega-Rounds By 27 Firms
By Jeff Dorsch - 02 Oct, 2019 - Comments: 0

It was also a good month for private equity firms and venture capitalists to raise their own rounds, with the money to be invested in early-stage companies and more mature ventures. A semiconductor company led the month. Nexperia, once the Standard Products business unit of NXP Semiconductors, took in $1.5 billion of senior credit facilities. The money will go toward refinancing debt and par... » read more

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