category: Top Stories

category: IoT, Security & Automotive

The Future Of Moore’s Law
By Ed Sperling - 03 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

Who’s Calling The Shots
By Ann Mutschler - 31 Jul, 2015 - Comments: 0

Throughout the PC era and well into the mobile phone market, it was semiconductor companies that called the shots while OEMs followed their lead and designed systems around chips. That’s no longer the case. A shift has been underway over the past half decade, and continuing even now, to reverse that trend. The OEM — or systems company as it is more commonly called today — now determine... » read more

Which Process, Material, IP?
By Ed Sperling - 30 Jul, 2015 - Comments: 1

For years chipmakers have been demanding more choices. They've finally gotten what they wished for—so many possibilities, in fact, that engineering teams of all types are having trouble wading through them. And to make matters worse, some choices now come with unexpected and often unwanted caveats. At the most advanced nodes it's a given that being able to shrink features and double patter... » read more

Securing EDA In The Cloud
By Brian Bailey - 30 Jul, 2015 - Comments: 1

In the first part of this article, EDA’s Clouded Future, the types of application suitable for cloud-based solutions were examined and the cost benefits that could arise for both EDA suppliers and consumers. Security has stood in the way of widespread adoption, but it is a little more complex than just being concerned about a theft of sensitive design data. Security involves data protect f... » read more

USB Connectors Get Smarter
By Ann Mutschler - 30 Jul, 2015 - Comments: 0

By now, there’s quite a buzz about the new USB Type-C spec given that it provides for a reversible plug connector for USB devices and cabling, aiming to end the endless cable flipping to make sure the orientation is correction. To avoid confusion, while developed at about the same time as the USB 3.1 specification, it is distinct from that one. When it comes to software support for Type-C,... » read more

Making Hardware Design More Agile
By Ed Sperling - 30 Jul, 2015 - Comments: 0

Semiconductor engineering sat down to whether changes are needed in hardware design methodology, with Philip Gutierrez, ASIC/FPGA design manager in [getentity id="22306" comment="IBM"]'s FlashSystems Storage Group; Dennis Brophy, director of strategic business development at [getentity id="22017" e_name="Mentor Graphics"]; Frank Schirrmeister, group director for product marketing of the System ... » read more

IP Verification Challenges
By Brian Bailey - 30 Jul, 2015 - Comments: 0

At the Design Automation Conference this year, the Designer and IP tracks were the stars of the show in many ways. These sessions catered to industry rather than academia and provided engineers with information they could directly use in their jobs. Many of the sessions were filled to capacity and Anne Cirkel, general chair for the 52nd DAC, was enthusiastic about the growing success of these t... » read more

Reliability After Planar Silicon
By Katherine Derbyshire - 29 Jul, 2015 - Comments: 2

Negative bias temperature instability (NBTI) poses a very serious reliability challenge for highly scaled planar silicon transistors, as previously discussed. However, the conventional planar silicon transistor appears to be nearing the end of its life for other reasons, too. The mobility of carriers in silicon limits switching speed even as it becomes more difficult to maintain sufficient elec... » read more

Executive Insight: Grant Pierce
By Ed Sperling - 27 Jul, 2015 - Comments: 0

Grant Pierce, president and CEO of Sonics, sat down with Semiconductor Engineering to talk about the effects of industry consolidation, China's impact, and the unfolding security threat with the IoT. What follows are excerpts of that interview. SE: Consolidation is one of the big stories right now. What does that mean for your company and the industry as a whole? Pierce: It's a very inter... » read more

Bigger, Brighter TVs
By Mark LaPedus - 24 Jul, 2015 - Comments: 0

The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite being in the eye of the innovation storm, FPD equipment makers remain cautious—and for good reason. There are a slew of new LCD fabs being built today, mostly in China. This, in turn, is promp... » read more

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