category: Top Stories

category: IoT, Security & Automotive

Fabless IDMs Redefine The Leading Edge
By Marie C. Baca - 27 Oct, 2022 - Comments: 0

Large systems companies are looking more like integrated device manufacturers, designing their own advanced chips, packages, and systems for internal use. But because these are not pure-play chip companies, they are disrupting a 10-year cadence of customization and standardization that has defined the chip industry from its inception, and extending the period of innovation without the associate... » read more

Bug-Free Designs
By Brian Bailey - 27 Oct, 2022 - Comments: 0

It is possible in theory to create a design with no bugs, but it's impractical, unnecessary, and extremely difficult to prove for bugs you care about. The problem is intractable because the potential state space is enormous for any practical design. The industry has devised ways to handle this complexity, but each has limitations, makes assumptions, and employs techniques that abstract the p... » read more

Which Foundry Is In The Lead? It Depends.
By Ed Sperling - 26 Oct, 2022 - Comments: 2

The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

Chip Challenges In The Metaverse
By Marie C. Baca and Ed Sperling - 24 Oct, 2022 - Comments: 0

The metaverse is pushing the limits of chip design, despite uncertainty about how much raw horsepower these devices ultimately will require to deliver an immersive blend of augmented, virtual, and mixed reality. The big challenge in developing these systems is the ability to process mixed data types in real time while the data moves uninterrupted at lightning speed. That requires the integra... » read more

SiPs: The Best Things in Small Packages
By Laura Peters - 20 Oct, 2022 - Comments: 0

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and processes. SiP is an essential packaging platform that integrates multiple functionalities onto a single substrate, which enables lower system cost, design flexibility, and superior electrical p... » read more

Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures
By Adele Hars - 20 Oct, 2022 - Comments: 0

Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these new 3D structures — some on the horizon but some already in high-volume manufacturing — semiconductor wafer equipment and materials suppliers in the wet cleaning business are at the epicenter... » read more

What’s Different About Next-Gen Transistors
By Katherine Derbyshire - 20 Oct, 2022 - Comments: 0

After nearly a decade and five major nodes, along with a slew of half-nodes, the semiconductor manufacturing industry will begin transitioning from finFETs to gate-all-around stacked nanosheet transistor architectures at the 3nm technology node. Relative to finFETs, nanosheet transistors deliver more drive current by increasing channel widths in the same circuit footprint. The gate-all-aroun... » read more

Bespoke Silicon Rattles Chip Design Ecosystem
By Ann Mutschler - 19 Oct, 2022 - Comments: 0

Bespoke silicon developers are shaking up relationships, priorities, and methodologies across the semiconductor industry, creating demand for skills that cross traditional boundaries, and driving new business models that leverage these enormous investments. Bespoke silicon designers today are a rare breed, capable of understanding the unique requirements of a specific domain, as well as a gr... » read more

Complex Tradeoffs In Inferencing Chips
By John Koon - 17 Oct, 2022 - Comments: 0

Designing AI/ML inferencing chips is emerging as a huge challenge due to the variety of applications and the highly specific power and performance needs for each of them. Put simply, one size does not fit all, and not all applications can afford a custom design. For example, in retail store tracking, it's acceptable to have a 5% or 10% margin of error for customers passing by a certain aisle... » read more

Foundational Changes In Chip Architectures
By Brian Bailey - 13 Oct, 2022 - Comments: 5

We take many things in the semiconductor world for granted, but what if some of the decisions made decades ago are no longer viable or optimal? We saw a small example with finFETs, where the planar transistor would no longer scale. Today we are facing several bigger disruptions that will have much larger ripple effects. Technology often progresses in a linear fashion. Each step provides incr... » read more

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