category: Top Stories

category: IoT, Security & Automotive

Competing V2V Technologies Emerge, Create Confusion
By John Koon - 05 Jan, 2023 - Comments: 0

The battle over vehicle-to-vehicle communications technology has begun, as governments step back to see which of two main competing standards and lots of related technology are best suited for reducing accidents. V2V is an often-discussed wireless communication protocol that enables vehicles to communicate with each other, easing traffic congestion, avoiding accidents, and ultimately improvi... » read more

Startup Funding: December 2022
By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Designing For Multiple Die
By Ann Mutschler - 21 Dec, 2022 - Comments: 1

Integrating multiple die or chiplets into a package is proving to be very different than putting them on the same die, where everything is developed at the same node using the same foundry process. As designs become more heterogeneous and disaggregated, they need to be modeled, properly floor-planned, verified, and debugged in the context of a system, rather than as individual components. Typi... » read more

RISC-V Pushes Into The Mainstream
By Marie C. Baca and Ed Sperling - 21 Dec, 2022 - Comments: 1

RISC-V cores are beginning to show up in heterogeneous SoCs and packages, shifting from one-off standalone designs toward mainstream applications where they are used for everything from accelerators and extra processing cores to security applications. These changes are subtle but significant. They point to a growing acceptance that chips or chiplets based on an open-source instruction set ar... » read more

Adapting To Broad Shifts Essential In 2022
By Brian Bailey - 21 Dec, 2022 - Comments: 0

Change creates opportunity, but not every company is able to respond quickly enough to take advantage of those opportunities. Others may respond too quickly, before they properly understand the implications. At the start of a typical year, optimism is in plentiful supply. Any positive trend is seen as continuing, and any negative is seen as turning around. Normally the later in the year that... » read more

Designing And Securing Chips For Outer Space
By Marie C. Baca - 19 Dec, 2022 - Comments: 2

Design considerations for hardware used in space go far beyond radiation hardening. These devices have to perform flawlessly for years, under extreme temperature variations, and potentially banged up by space junk or other particles floating in the void over its projected lifetime. Reliability in space adds a whole different set of design considerations. For example, while it's unlikely anyo... » read more

How Far Will Copper Interconnects Scale?
By Laura Peters - 15 Dec, 2022 - Comments: 0

As leading chipmakers continue to scale finFETs — and soon nanosheet transistors — to ever-tighter pitches, the smallest metal lines eventually will become untenable using copper with its liner and barrier metals. What comes next, and when, is still to be determined. There are multiple options being explored, each with its own set of tradeoffs. Ever since IBM introduced the industry to c... » read more

Ferroelectrics: The Dream Of Negative Capacitance
By Katherine Derbyshire - 15 Dec, 2022 - Comments: 0

Ferroelectrics are getting a serious re-examination, as chipmakers look for new options to maintain drive current. Ferroelectric materials can provide non-volatile memory, serving an important functional gap somewhere between DRAM and flash memory. Indeed, ferroelectrics for memory and 2D channels for transistors were two highlights of the recent IEEE Electron Device Meeting. Ferroelectri... » read more

The March Toward Chiplets
By Ed Sperling and Karen Heyman - 15 Dec, 2022 - Comments: 0

The days of monolithic chips developed at the most advanced process nodes are rapidly dwindling. Nearly everyone working at the leading edge of design is looking toward some type of advanced packaging using discrete heterogeneous components. The challenge now is how to shift the whole chip industry into this disaggregated model. It's going to take time, effort, as well as a substantial reali... » read more

3D-IC Reliability Degrades With Increasing Temperature
By Ann Mutschler - 14 Dec, 2022 - Comments: 0

The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been problematic in semiconductor design since at least 28nm, it is much more challenging to deal with inside a 3D package, where electromigration can spread to multiple chips on multiple levels. “Be... » read more

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