category: Top Stories

category: IoT, Security & Automotive

L5 Adoption Hinges on 5G/6G
By Marie C. Baca - 31 Aug, 2022 - Comments: 1

Truly self-driving cars don’t yet exist, and research shows many consumers are wary of them anyway. What will it take to make fully autonomous cars possible? And how can automakers convince consumers to adopt such vehicles? Experts say the answer to both questions could lie in wireless communication networks. That’s because such networks offer a workaround to a major obstacle in autonomo... » read more

MicroLEDs Move Toward Commercialization
By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

The Next Incarnation Of EDA
By Brian Bailey - 25 Aug, 2022 - Comments: 0

The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

How Climate Change Affects Data Centers
By Marie C. Baca - 25 Aug, 2022 - Comments: 0

Data centers are hot, and they may get even hotter. As climate change impacts temperatures around the world, designers are changing the computing hubs that are tied to nearly every aspect of modern life to make them more efficient, more customized, and potentially more disaggregated. These shifts are taking on new urgency as the tech industry grapples with months of sweltering temperatures o... » read more

Verification Scorecard: How Well Is The Industry Doing?
By Brian Bailey - 25 Aug, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss how well verification tools and methodologies have been keeping up with demand, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president of product marketing at Caden... » read more

Is There A Limit To The Number of Layers In 3D-NAND?
By Karen Heyman - 24 Aug, 2022 - Comments: 1

Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

Chipmakers Model AI For Radio Access Networks
By Martha DeGrasse - 22 Aug, 2022 - Comments: 0

The chips that power and connect smartphones are now foundational to a disparate portfolio of daily tasks we take for granted, from accessing the internet to snapping a photo or asking Siri or Google if rain is in the forecast. Most people don’t think twice about the conflicting demands these tasks can place on semiconductors, but for engineers at leading chip manufacturers, this balancing ac... » read more

Big Changes In Architectures, Transistors, Materials
By Ed Sperling - 18 Aug, 2022 - Comments: 0

Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

Fan-Out Packaging Gets Competitive
By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Equipment Suppliers Brace For GaN Market Explosion
By Adele Hars - 18 Aug, 2022 - Comments: 0

A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

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