category: Top Stories

category: IoT, Security & Automotive

What’s Next For Transistors And Chiplets
By Mark LaPedus - 21 Oct, 2021 - Comments: 5

Sri Samavedam, senior vice president of CMOS Technologies at Imec, sat down with Semiconductor Engineering to talk about finFET scaling, gate-all-around transistors, interconnects, packaging, chiplets and 3D SoCs. What follows are excerpts of that discussion. SE: The semiconductor technology roadmap is moving in several different directions. We have traditional logic scaling, but packaging i... » read more

Improving Accuracy In Satellite Navigation Systems
By Bryon Moyer - 20 Oct, 2021 - Comments: 0

Increasing dependency on the global navigation satellite system (GNSS) constellations is raising concerns about what happens when signals are unavailable, even for short periods of time. GNSS systems affect our daily lives in ways we often don’t see, from location services to cell phone timing. In fact, these satellites have become a necessary part of critical infrastructure, and higher ac... » read more

Get Ready For The Next Generation Of Wearable Tech
By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

Will Co-Packaged Optics Replace Pluggables?
By Bryon Moyer - 14 Oct, 2021 - Comments: 0

As optical connections work their way deeper into the data center, a debate is underway. Is it better to use pluggable optical modules or to embed lasers deep into advanced packages? There are issues of convenience, power, and reliability driving the discussion, and an eventual winner isn’t clear yet. “The industry is definitely embracing co-packaged optics,” said James Pond, principal... » read more

Rising Fortunes For ICs In Health Care
By Susan Rambo - 13 Oct, 2021 - Comments: 0

Semiconductors are increasingly finding their way into a variety of medical devices, after years of slow growth and largely consumer electronics types of applications. Nearly every major chipmaker has a toehold in health care these days, and many are starting to look beyond wearable such as the Apple Watch to devices that can be relied on for accuracy and reliability. Unlike in the past, the... » read more

Inspecting, Testing, And Measuring SiC
By Patrick Waurzyniak - 12 Oct, 2021 - Comments: 0

Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

One Test Is Not Always Enough
By Anne Meixner - 12 Oct, 2021 - Comments: 0

To improve yield, quality, and cost, two separate test parameters can be combined to determine if a part passes or fails. The results gleaned from that approach are more accurate, allowing test and quality engineers to fail parts sooner, detect more test escapes, and ultimately to improve yield and reduce manufacturing costs. New data analytic platforms, combined with better utilization of s... » read more

PCB And IC Technologies Meet In The Middle
By Bryon Moyer - 12 Oct, 2021 - Comments: 1

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

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