category: Top Stories

category: IoT, Security & Automotive

IC Data Hot Potato: Who Owns And Manages It?
By Susan Rambo And Ed Sperling - 06 Jul, 2021 - Comments: 1

Modern inspection, metrology, and test equipment produces a flood of data during the manufacturing and testing of semiconductors. Now the question is what to do with all of that data. Image resolutions in inspection and metrology have been improving for some time to deal with increased density and smaller features, creating a downstream effect that has largely gone unmanaged. Higher resoluti... » read more

New Design Approaches For Automotive
By Ann Mutschler - 01 Jul, 2021 - Comments: 0

The push toward increasing autonomy in automotive is driving new approaches in electronics development. Instead of designing individual components, the focus now is on modeling in context. The ultimate goal is to create an executable specification based on industry-accepted standards, with enough flexibility to be able to customize that spec for different customers. This is a difficult engin... » read more

IoT Security: Confusing And Fragmented
By Bryon Moyer - 01 Jul, 2021 - Comments: 0

Security regulations for Internet-of-Things (IoT) devices are evolving around the world, but there is no consistent set of requirements that can be applied globally — and there may never be. What exists today is a patchwork of certification labs and logos. That makes it difficult for IoT-device designers to know where to get their security blessed. Unlike in data centers, where there is a ... » read more

Challenges In Developing A New Inferencing Chip
By Ed Sperling - 01 Jul, 2021 - Comments: 0

Cheng Wang, co-founder and senior vice president of software and engineering at Flex Logix, sat down with Semiconductor Engineering to explain the process of bringing an inferencing accelerator chip to market, from bring-up, programming and partitioning to tradeoffs involving speed and customization.   SE: Edge inferencing chips are just starting to come to market. What challenges di... » read more

Debug: The Schedule Killer
By Brian Bailey - 30 Jun, 2021 - Comments: 0

Debug often has been labeled the curse of management and schedules. It is considered unpredictable and often can happen close to the end of the development cycle, or even after – leading to frantic attempts at work-arounds. And the problem is growing. "Historically, about 40% of time is spent in debug, and that aspect is becoming more complex," says Vijay Chobisa, director of product manag... » read more

Data Centers On Wheels
By Ann Mutschler - 28 Jun, 2021 - Comments: 2

Automotive architectures are evolving quickly from domain-based to zonal, leveraging the same kind of high-performance computing now found in data centers to make split-second decisions on the road. This is the third major shift in automotive architectures in the past five years, and it's one that centralizes processing using 7nm and 5nm technology, specialized accelerators, high-speed memor... » read more

Rocky Road To Designing Chips In The Cloud
By Ann Mutschler - 24 Jun, 2021 - Comments: 0

EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

Architectural Considerations For AI
By Brian Bailey - 24 Jun, 2021 - Comments: 2

Custom chips, labeled as artificial intelligence (AI) or machine learning (ML), are appearing on a weekly basis, each claiming to be 10X faster than existing devices or consume 1/10 the power. Whether that is enough to dethrone existing architectures, such as GPUs and FPGAs, or whether they will survive alongside those architectures isn't clear yet. The problem, or the opportunity, is that t... » read more

CEO Outlook: More Data, More Integration, Same Deadlines
By Ed Sperling - 24 Jun, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the future of chip design and EDA tools with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; and Babak Taheri, CEO of Silvaco. What ... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

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