category: Whitepapers

category: IoT, Security & Automotive

Three Key Reasons That The Future Of Smart Home Devices Is Embedded Contextual AI
By Synaptics - 06 Mar, 2025 - Comments: 0

Artificial intelligence has become a transformative force, reshaping how consumers interact with technology. Consumer-level AI tools like ChatGPT have set new benchmarks for smart home devices, raising expectations for seamless functionality, natural language interactions, and personalized user experiences. As consumers demand smarter, more intuitive devices, embedded engineers and system engin... » read more

Secure Interfaces for Critical Semiconductor Applications
By Synopsys - 06 Mar, 2025 - Comments: 0

Security is now a concern for nearly all semiconductors in nearly all applications. Once of high interest mostly for military and financial systems, both the increasingly connected world and the plethora of existing security threats have changed the landscape dramatically. Every aspect of electronic system design—hardware, firmware, and software—has its own sets of risks and requirements to... » read more

Shift Left With Calibre Pattern Matching
By Siemens EDA - 06 Mar, 2025 - Comments: 0

As integrated circuit (IC) designs become increasingly complex, early-stage verification is crucial to ensure productivity and quality in design processes. The "shift left" verification approach, enabled by Siemens’ Calibre nmPlatform, helps IC design teams to identify and resolve critical issues much earlier in the design cycle. As part of the shift left platform, Calibre Pattern Matching... » read more

Seamless ECAD and MCAD Collaboration
By Cadence - 06 Mar, 2025 - Comments: 0

Integrating electronic computer-aided design (ECAD) and mechanical computer-aided design (MCAD) systems is critical for achieving efficient and accurate design outcomes in the rapidly evolving landscape of product design. This article explores the prevalent challenges designers and engineers face in ECAD-MCAD integration and how these challenges can be effectively addressed through integrating ... » read more

Understanding And Navigating The Complexities of Health Monitoring For Power Supplies
By Infineon - 06 Mar, 2025 - Comments: 0

This white paper introduces an innovative solution, which is designed to transform traditional reliability prediction procedures into the industry’s first commercially available embedded power supply health monitoring solution. This approach uses cutting-edge embedded data analytics on real-time telemetry data and a power system reliability model to dynamically recalculate the failure rate of... » read more

A Novel Approach For Hardware-Software Co-Verification
By Siemens EDA - 26 Feb, 2025 - Comments: 0

The complexity of system on chips (SoCs) continues to grow rapidly. Accordingly, new standards and methodologies are introduced to overcome these verification challenges. The Portable Test and Stimulus Standard (PSS) from Accellera is one of the standard examples used to pursue such challenges. In this paper we will show a methodology to use PSS to orchestrate the process of HW/SW co-verificati... » read more

Pre-Silicon Verification Of Die-to-Die IP With Novel ESD Protection
By Synopsys - 26 Feb, 2025 - Comments: 0

All major foundries have adopted the programmable electrical rule checker (PERC) as the pre-silicon electrostatic discharge (ESD) signoff tool for IP and chip designs. This concept of rule checking works fine for most IP types, but for die-to-die IP, used in 3DIC designs, the PERC approach may not be appropriate. Die-to-die interface IP includes extremely large numbers of I/Os, trending towards... » read more

Boost SoC Efficiency And Speed With FlexGen Smart NoC IP Automation
By Arteris - 26 Feb, 2025 - Comments: 0

Today’s high-end SoCs contain many heterogeneous processing elements to address the needs of HPC and AI applications. These include Central Processing Units (CPUs), Graphics Processing Units (GPUs), Neural Processing Units (NPUs), Tensor Processing Units (TPUs), and other hardware accelerators. Furthermore, IPs may contain clusters of these processor cores, and SoC subsystems may include arra... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC
By Cadence - 26 Feb, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. This white paper analyzes the impact of mat... » read more

Testing Analog And Digital Components In Modern PCBAs
By Keysight - 26 Feb, 2025 - Comments: 0

Modern printed circuit board assemblies (PCBAs) are designed to support increasingly complex applications in industries such as telecommunications, automotive, consumer electronics, and industrial automation. Many applications require analog and digital components to function seamlessly within a single board. This integration of analog and digital technologies requires comprehensive testing to ... » read more

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