category: Whitepapers

category: IoT, Security & Automotive

Overcoming Signal Integrity Challenges Of 112G Connections
By Cadence - 13 Mar, 2024 - Comments: 0

One of the big challenges with 112G SerDes (and, to a lesser extent, all SerDes) is handling signal integrity issues. In the worst case of a long-reach application, the signal starts at the transmitter on one chip, goes from the chip to the package, across a trace on a printed-circuit board (PCB), through a connector, then a cable or backplane, another connector, another PCB trace, another pack... » read more

Effectively Monitor And Streamline Test Processes Using A DAQ
By Keysight - 13 Mar, 2024 - Comments: 0

Manufacturing and field operations generate a high volume of data, and they are also fueling growth in the use of smart remote sensing and the Industrial Internet of Things (IIoT). The data that is generated gives users visibility into their operations in real time or near real time to help them make decisions quickly. Time is a critical factor when high-volume production lines go down, electri... » read more

Simulation With Taint Propagation For Security Verification
By Synopsys - 13 Mar, 2024 - Comments: 0

Security has arisen as a primary concern for many types of electronic devices. A wide range of malicious agents is constantly probing and looking for weaknesses to try to steal confidential information or exert unauthorized control. The need for security has been well understood and widely adopted in software for years. Techniques such as passwords, multi-factor authentication, and biometric ch... » read more

Workload Trace Generation
By Arm - 13 Mar, 2024 - Comments: 0

The intended audience for this document is a performance engineer preparing traces for performance prediction on new Arm hardware. It is expected that the reader understands the basic concepts of performance engineering such as: • Workload characterization • Identifying key aspects of a workload • Understanding how Performance Monitor Unit (PMU) events correlate to a workload Click her... » read more

Overcoming The Challenges Of Verifying Multi-Die Systems
By Synopsys - 12 Mar, 2024 - Comments: 0

Despite clear advantages of multi-die systems, the decision to design a multi-die system rather than a traditional monolithic SoC is not easy. There are numerous new challenges that stand in the way of multi-die system realization. This white paper focuses on the verification challenges of multi-die systems, including: Addressing capacity and performance for system verification Valid... » read more

MIMO Application Framework
By NI - 12 Mar, 2024 - Comments: 0

Massive MIMO is an exciting area of 5G wireless research. For next-generation wireless data networks, it promises significant gains that offer the ability to accommodate more users at higher data rates with better reliability while consuming less power. Using the NI Massive MIMO Software Architecture, researchers can build Massive MIMO testbeds to rapidly prototype large-scale antenna systems u... » read more

Application-Specific Power Performance Optimizer Based On Chip Telemetry
By proteanTecs - 12 Mar, 2024 - Comments: 0

As datacenter power consumption continues to pose cooling and cost challenges, and battery driven devices are expected to last longer between charges, the search for advanced power management mechanisms continues. A modern design must balance between maximizing performance, consuming the least amount of power, and guaranteeing no failures in field. The latter requires safety margins which tr... » read more

Complex Safety Mechanisms Require Interoperability And Automation For Validation And Metric Closure
By Siemens EDA - 06 Mar, 2024 - Comments: 0

The race to autonomous mobility among the automobile manufacturers is driving the evolution of the underlying semiconductors. As a result, semiconductor technologies are moving towards higher densities and lower operating voltages, and this migration is introducing increasing sensitivity to random hardware failures – the failures which occur unpredictably over a semiconductor’s lifetime. Mo... » read more

Next Generation Highly Power-Efficient AI Accelerator (DRP-AI3)
By Renesas - 06 Mar, 2024 - Comments: 0

As the working population decreases due to falling birthrates and a growing proportion of the population being elderly, advanced artificial intelligence (AI) processing, such as recognition of the surrounding environment, decision of actions, and motion control, will be required in various aspects of society, including factories, logistics, medical care, service robots operating in the city, an... » read more

Optimized Drivetrain And New Semiconductor Technologies Enable The Design Of Energy-Efficient Electric Vehicles
By Infineon - 06 Mar, 2024 - Comments: 0

The traction inverter is the core component of the drivetrain in all-electric vehicles, making it the most essential system: The device plays a crucial role in enabling efficient and sustainable electromobility since it directly influences the power output and significantly affects the vehicle’s dynamics. However, to develop efficient electric vehicles the integration of complementary sub... » read more

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