A Novel Photosensitive Permanent Bonding Material Designed For Polymer/Metal Hybrid Bonding Applications


Wafer-level hybrid bonding techniques, which provide simultaneous bonding between metal-metal and dielectric-dielectric layers, have attracted more attention in recent years for fabricating 3D integrated circuits with high bandwidth and high interconnect density. However, there are some issues for conventional hybrid bonding using silicon oxide as the dielectric, such as the high stress and low... » read more

Verifying A DDR5 Memory Subsystem


With the increasing complexity of DDR memory models and a vast set of configurations, it has become a daunting experience for verification engineers to verify memory subsystems. With the help of DDR5 Questa VIP and its unique features, engineers can maximize their debugging capabilities and achieve their verification goals quickly and efficiently. This paper introduces the Siemens EDA DDR5 and ... » read more

Synchronization Overview And Case Study on Arm Architecture


The objective of this white paper is to share knowledge on Arm architecture. The target reader of this document is those who work on synchronization with the Arm architecture. [Warning] When we are dealing with locking optimizations, we must be extremely careful about correctness. Bugs caused by synchronization are usually hard to root cause and the optimized code may crash on other CPUs wit... » read more

Authenticating Batteries Before Rapid And Fast Charging


If asked, most consumers will complain about the battery life of their smartphone. In reality, this is more a charging issue since, with traditional charging solutions, even a couple of hours of charging can result in a minimal improvement in charge on some handsets. Smartphone manufacturers are differentiating their offering by providing fast or rapid charging solutions. However, this places t... » read more

Compute Express Link (CXL): All You Need To Know


An in-depth look at Compute Express Link  (CXL) 2.0, an open standard cache-coherent interconnect between processors and accelerators, smart NICs, and memory devices. We explore how CXL is helping data centers more efficiently handle the yottabytes of data generated by artificial intelligence (AI) and machine learning (ML) applications. We discuss how CXL technology maintains memory c... » read more

Fidelity Pointwise Grid Cell Remediation Method For Overset Meshes


In computational fluid dynamics, (CFD) overset meshing is highly appreciated in turbomachinery for moving body applications. Moreover, significant efforts have been made to improve the overset flow solver capability, but only limited developments have been made to what is quickly becoming a bottleneck in the simulation process — the creation of the overset composite grid. Cadence Fidelity Poi... » read more

The Value Of High-Performance Computing For Simulation


This white paper breaks down the costs and time savings associated with implementing high-performance computing technology. High-performance computing (HPC) is an enormous part of the present and future of engineering simulation. HPC allows best-in-class companies to gain high-fidelity insight into product behavior, insight that cannot be obtained without the detailed simulation models – i... » read more

Choosing The Right Photonic Device Design Software


There are many factors to consider before deciding which software to use for photonic device design. To narrow the field, it can be helpful to ask these key questions as you investigate and compare software functionality. • Does the software provide enough flexibility to model and analyze products that offer the best solution to likely and possible design goals? • Is the simulation ca... » read more

The Human Hand: Curating Good Data And Creating An Effective Deep-Learning R2R Strategy For High-Volume Manufacturing


Currently, the semiconductor manufacturing industry uses artificial intelligence and machine learning to take data and autonomously learn from that data. With the additional data, AI and ML can be used to quickly discover patterns and determine correlations in various applications, most notably those applications involving metrology and inspection, whether in the front-end of the manufacturing ... » read more

GaN 8Gbps High-Speed Relay MMIC For Automated Test Equipment


An 8 Gbps high-speed relay MMIC for an Automated Test Equipment (ATE) using a gallium nitride is developed and evaluated. Metal-Insulator-Semiconductor structure with a tantalum oxynitride is employed to reduce a leakage current for ATE applications. The fabricated MMIC shows 0.3 nA of the leakage current, 12 GHz of a -3 dB bandwidth, and excellent eye-opening of 8 Gbps signals with a 18-lead... » read more

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