SEMI’s Year-End Total Semiconductor Equipment Forecast — OEM Perspective, 2022


Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new high of $108.5 billion in 2022, rising 5.9% from the previous industry record of $102.5 billion in 2021, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspectiveat SEMICON Japan 2022. The record high caps three consecutive years of re... » read more

Samsung PM9A3 All Flash Reference Platform


Software Defined Storage continues to gain momentum in the modern datacenter storage market. As datacenter storage in- frastructures and technologies evolve, the need for speed and flexibility in the storage system becomes evident. NVMe is at the forefront of these advancements. Weka is a software defined storage system that is designed to meet the needs of today’s I/O intensive workloads. It... » read more

Holistic Die-to-Die Interface Design Methodology For 2.5-D Multi-Chip-Module Systems


More than Moore technologies can be supported by system level diversification enabled by chiplet based integrated systems within multi-chip-modules (MCM) and silicon interposer based 2.5D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at system level whil... » read more

Physics-Based Radar Modeling: Driving Toward Increased Safety


Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, road signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on the flawless performance of the car’s perception systems, including radar-ba... » read more

12 Ways To Elevate Electronic Design Process Using PADS eBook


When using PADS Professional Premium, designers have access to standard PCB design functionality, such as schematic definition and physical layout, as well previously optional add-on features (now standard) and all of the latest cloud apps, including: Schematic definition: Access to everything you need: Circuit design and simulation, Component selection, library management, and signal integr... » read more

Tensilica DSP Code Generation Toolbox With MATLAB/Simulink


MATLAB and Simulink are widely used for modeling and simulating real-time dynamical systems. To verify the performance of MATLAB/Simulink models of these systems in a real-time application, MATLAB/Simulink models are converted to embedded C code and executed on a target processor or its equivalent Instruction Set Simulator (ISS). To deploy the generated C code in a processor, the genera... » read more

Jitter Budgeting For Clock Distribution Networks In High-Speed PHYs And SerDes


This paper presents a simple but practically precise estimation of periodic single-tone power supply induced jitter (PSIJ) for MOS clock buffer chains. The estimation is algebraically simple for its analytical closed-form expression requiring only a few circuit simulation results without the pre-knowledge of circuit device SPICE parameters. The expression is well suited to predict period PSIJ, ... » read more

Adding Differentiating Value And Reducing IP Integration Time for Your SoC


In the most efficient SoC design processes, semiconductor companies design their own, differentiated IP blocks, acquire high-quality third-party IP, configure it in an SoC-optimized way, and integrate all blocks into the SoC infrastructure of clocks, voltage supplies, on-chip buffer memories or registers, and test circuits. The SoC design team defines and drives the SoC-specific implementation ... » read more

Packetized Scan Test


Bus-based packetized scan data decouples test delivery and core-level DFT requirements so core-level compression configuration can be defined completely independently of chip I/O limitations. Grouping cores for concurrent testing is selected programmatically, not hard-wired. This concept dramatically reduces the DFT planning and implementation effort. The Siemens solution for packetized deli... » read more

Peeling The Onion Of An Automotive IC Digital Twin


This paper defines the modern digital twin in the context of the automotive industry and as it applies to the ICs being deployed therein. Additionally, it surveys the implications arising from the need to use digital twins to connect the virtual and physical worlds for semiconductor suppliers delivering the next generation of automotive capabilities. Why should I care about digital twins? T... » read more

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